torley

Elaborate the difference between Physical and Chemical Etching.

Etching techniques can be divided into two main categories. Please explain the difference between these two techniques with reference to plasma etching.
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gangeshh
spattering etching; process of etching through actual physical communications (push move)between more rapid chemically torpid ions (E.g. Are+)in addition to etch unanimous; anisotropic, low-discerning.
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kali
• In physical etching, positive ions bombard the surface at high speed; small amounts of negative ions formed in the plasma cannot reach the wafer surface and therefore play no direct role in plasma etching. • In chemical etching, neutral reactive species generated by the plasma interact with the material surface to form volatile products. Source: http://in.docsity.com/en-docs/Etching-Fundamentals_of_Semiconductor_Fabrication-Lecture_Slides_
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