Elaborate the difference between Physical and Chemical Etching.

Etching techniques can be divided into two main categories. Please explain the difference between these two techniques with reference to plasma etching.
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spattering etching; process of etching through actual physical communications (push move)between more rapid chemically torpid ions (E.g. Are+)in addition to etch unanimous; anisotropic, low-discerning.
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• In physical etching, positive ions bombard the surface at high speed; small amounts of negative ions formed in the plasma cannot reach the wafer surface and therefore play no direct role in plasma etching. • In chemical etching, neutral reactive species generated by the plasma interact with the material surface to form volatile products. Source:
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