4. MOS Transistor Theory, Slides of Designs and Groups

Necessary to understand basic electrical properties of the MOS transistor to design useful circuits. Deal with non-ideal devices.

Typology: Slides

2021/2022

Uploaded on 07/05/2022

carol_78
carol_78 🇦🇺

4.8

(59)

1K documents

1 / 34

Toggle sidebar

This page cannot be seen from the preview

Don't miss anything!

bg1
4. MOS Transistor Theory
Jacob Abraham
Department of Electrical and Computer Engineering
The University of Texas at Austin
VLSI Design
Fall 2020
September 8, 2020
ECE Department, University of Texas at Austin Lecture 4. MOS Transistor Theory Jacob Abraham, September 8, 2020 1 / 31
pf3
pf4
pf5
pf8
pf9
pfa
pfd
pfe
pff
pf12
pf13
pf14
pf15
pf16
pf17
pf18
pf19
pf1a
pf1b
pf1c
pf1d
pf1e
pf1f
pf20
pf21
pf22

Partial preview of the text

Download 4. MOS Transistor Theory and more Slides Designs and Groups in PDF only on Docsity!

4. MOS Transistor Theory

Jacob Abraham

Department of Electrical and Computer Engineering

The University of Texas at Austin

VLSI Design

Fall 2020

September 8, 2020

Electrical Properties

Necessary to understand basic electrical properties of the MOS transistor to design useful circuits Deal with non-ideal devices Ensure that the circuits are robust Create working layouts Predict delays and power consumption As circuit dimensions scale down, electrical effects become more important, even for digital circuits 1.65 GHz square wave from an HDMI Interface (Source: Dunnihoo, EE Times Asia, 8/25/2005)

Modes in nMOS Structure

nMOS Transistor Operation

Positive voltage on Gate produces electric field across substrate – attracts electrons to the Gate and repels holes With sufficient voltage, region under Gate changes from p- to n-Type – conducting path between the Source and Drain Inversion layer is field-induced junction, unlike a PN junction which is metallurgical Horizontal component of electric field associated with Vds > 0 is responsible for sweeping electrons from channel to drain

Threshold Voltage The gate voltage at which conduction takes place is the Threshold Voltage, Vt Current flow occurs when the drain to source voltage Vds > 0 , and consists almost entirely of majority-carriers (electrons), that flow through the channel A depletion region insulates the channel from the substrate

nMOS Device Behavior

Vgs > Vt, Vds = 0

Saturated Mode (Vds > Vgs − Vt)

Nonsaturated Mode Vds < Vgs − Vt

The pMOS Transistor

Moderately doped n- type substrate (or well) in which two heavily doped p+ regions, the Source and Drain, are diffused

Application of a negative gate voltage (w.r.t. source) draws holes into the region below the gate; channel changes from n to p-type (source-drain conduction path) Conduction due to holes; negative Vd sweeps holes from source (through channel) to drain

Carrier Velocity

Charge is carried by electrons Carrier velocity ν proportional to lateral E- field between source and drain ν = μE μ is called mobility E = Vds/L Time for carrier to cross channel: t = L/ν

I-V Characteristics

nMOS Linear I-V Current can be obtained from charge in channel and the time t each carrier takes to cross Ids = Qchannel t = μCox

W

L

(Vgs − Vt − Vds/2) Vds = β (Vgs − Vt − Vds/2) Vds

nMOS Saturation I-V If Vgd < Vt, channel pinches off near drain when Vds > Vdsat = Vgs − Vt Now drain voltage no longer increases with current Ids = β (Vgs − Vt − Vdsat/2) Vdsat

=

β 2 (Vgs − Vt)^2

pMOS I-V

All dopings and voltages are inverted for pMOS (compared with nMOS) Mobility μp is determined by holes Typically 2x-3x lower than that of electrons μn Thus pMOS must be wider to provide the same current Simple assumption, μ μnp = 2

Capacitance

Capacitance in CMOS circuits Two conductors separated by an insulator have capacitance Gate to channel capacitor is very important Creates channel charge necessary for operation Source and drain have capacitance to body Across reverse-biased diodes Called diffusion capacitance because it is associated with source/drain diffusion Interconnection wires also have (distributed) capacitance

Gate Capacitance Approximate channel as connected to source Cgs = oxW L/tox = CoxW L = CpermicronW Typical Cpermicron ≈ 2fF/μm

Device Capacitances, Cont’d

Off Region Vgs ≤ Vt; when the MOS device is off, only Cgb (due to the series combination of gate oxide and depletion layer capacitance) is non-zero. Cgb = Cox = A/tox, where A is the gate area, and  =  0 SiO 2  0 is the permittivity of free space ( 8. 854 × 104 F/m), and SiO 2 is the dielectric constant of SiO 2 (about 3.9)

Linear Region Depletion region exists, forming dielectric of depletion capacitance, Cdep in series with Cox As the device turns on, Cgb reduces to 0 The gate capacitance is now a function of the gate voltage

Device Capacitances, Cont’d

Saturated Region Region under the gate is heavily inverted, and drain region of channel pinched off, with Cgd reducing to zero Gate capacitance is now less than Cox

Approximation of Gate Capacitance For simplicity, we can assume the gate capacitance to be constant, Cg = A/tox

Pass Transistors

Have assumed that source is grounded

What happens if source > 0? Example, pass transistor passing VDD Vg = VDD If Vs > VDD − Vt, Vgs < Vt Hence, transistor would turn itself off

nMOS pass transistors pull no higher than VDD − Vt Called a degraded “1” Degraded value reached slowly in a transition (low Ids)

pMOS pass transistors pull no lower than Vtp Degraded “0”

Pass Transistor Circuits

What would be the voltages on the different nodes?