Embedded Processors - High-Performance Processors and Systems | ECE 569, Study notes of Electrical and Electronics Engineering

Material Type: Notes; Professor: Rao; Class: High-Performance Processors and Systems; Subject: Electrical and Computer Engr; University: University of Illinois - Chicago; Term: Unknown 2007;

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Embedded Processors
Lec 21
Embedded systems overview
Computing systems are everywhere
Most of us think of “desktop” computers
- PC’s
- Laptops
- Mainframes
- Servers
But there’s another type of computing system
- Far more common...
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Download Embedded Processors - High-Performance Processors and Systems | ECE 569 and more Study notes Electrical and Electronics Engineering in PDF only on Docsity!

Embedded Processors

Lec 21

Embedded systems overview

 Computing systems are everywhere

 Most of us think of “desktop” computers

  • PC’s
  • Laptops
  • Mainframes
  • Servers

 But there’s another type of computing system

  • Far more common...

What are Embedded Systems?

Generic Definition:

“nearly any computing system other than a

desktop computer”

Embedded systems overview

 Embedded computing systems

  • Computing systems embedded within

electronic devices

  • Hard to define. Nearly any computing

system other than a desktop computer

  • Billions of units produced yearly,

versus millions of desktop units

  • Perhaps 50 per household and per

automobile

Computers are in here... and here...

and even here...

Lots more of these, though they cost a lot less each.

Some categories…

 Signal processing systems

  • radar, sonar, real-time video, set-top boxes, DVD players, medical equipment, residential gateways

 Mission critical systems

  • avionics, space-craft control, nuclear plant control

 Distributed control

  • network routers & switches, mass transit systems, elevators in large buildings

 “Small” systems

  • cellular phones, pagers, home appliances, toys, smart cards, MP players, PDAs, digital cameras and camcorders, sensors, smart badges

 Large dynamic range of attributes and capabilities

A Variety of Application Domains

 Hybrid and embedded systems

  • Aerospace, automobiles, robotics, process control, sensor networks

 Multimedia

  • Virtual reality, immersive environment

 Consumer electronics

  • Mobile phones, office electronics, digital appliances

 Network components

  • Bridges, routers, switches, hubs

 Medical devices and instruments

  • Patient monitoring, MRI, infusion pumps, artificial organs

 E-business

  • ATM, vending machines

 Distributed and grid computing

  • Critical infrastructure defense system, air traffic control, intelligent highway systems, emergence response system

Some common characteristics of

embedded systems

 Single-functioned

  • Executes a single program, repeatedly

 Tightly-constrained

  • Low cost, low power, small, fast, etc.

 Reactive and real-time

  • Continually reacts to changes in the system’s environment
  • Must compute certain results in real-time without delay

An embedded system example -- a

digital camera

Microcontroller

A2D^ CCD preprocessor^ Pixel coprocessor^ D2A

JPEG codec

DMA controller

Memory controller ISA bus interface UART LCD ctrl

Display ctrl

Multiplier/Accum

Digital camera chip

lens

CCD

 Single-functioned -- always a digital camera

 Tightly-constrained -- Low cost, low power, small, fast

 Reactive and real-time -- only to a small extent

Why do we care? Some Market Tidbits...

 Specialized devices replacing general PC

  • set-top boxes, fixed-screen phones, smart mobile phones, iPods, PDAs,etc.
  • Vast majority of inter access devices are appliances and not PCs
    • In 1997, 96% of internet access devices sold in the US were PCs
    • Now, unit shipments of just internet-enabled cells phones exceed PCs

 Traditional systems becoming dependent on computation systems

  • Modern cars: up to ~100 processors running complex software
    • engine & emissions control, stability & traction control, diagnostics, gearless automatic transmission  An indicator:
  • where are the CPUs being used?

Why do we care?

Some Market Tidbits...in $$$$

 General Purpose Computing

  • PC Chipsets ($6.9B) expected to grow to $10.3B in 2009

 Embedded Systems

  • Wi-Fi ($140M) expected to grow 3x by 2009 (mobile PCs, residential networks, cell phones)
  • Media Devices (digital TVs, MP3 players, video games consoles)
  • ASIC ($209.8M) expected to grow to $2.53B in 2009 (ASSP)
  • RFID ($1.3B) expected to grow 25x by 2010

57.0%

10.5%

90.4%

86.3%

31.6%

Compound Annual Growth Rate

Example: Automotive Telematics  In 2005, 30-90 processors per car

  • Engine control, Break system, Airbag deployment system
  • Windshield wiper, door locks, entertainment systems  Example: BMW 745i
  • 2,000,000 LOC
  • Window CE OS
  • Over 60 microprocessors
  • 53 8-bit, 11 32-bit, 7 16-bit
  • Multiple networks
  • Buggy?  Problems?
  • Disparity between the design cycle of a car and the design cycle of embedded components
  • Difficult to upgrade
  • Not possible to integrate the user’s own devices into a car

Source:Source:^ InsupInsup^ Lee,Lee,^ UPennUPenn

Challenges

 Three aspects of embedded system development

  • Embedding for smart control
  • Creating new computing gadgets
  • Connecting the physical world to the computing infrastructure

 The goal is to make them invisible cost-effectively!

  • Trustworthy: should not fail (or gracefully degrade), and safe to use. The existence of embedded software becomes apparent only when an embedded system fails.
  • Context Aware: should be able to sense people, environment, and threats and to plan/notify/actuate responses to provide real-time interaction with the dynamically changing physical environment with limited resources.
  • Seamless Integration: should be invisible at multiple levels of a hierarchy: home systems, metropolitan systems, regional systems, and national systems.

Design challenge –

optimizing design metrics

 Common metrics

  • Unit cost:
    • the monetary cost of manufacturing each copy of the system, excluding NRE cost
  • NRE cost (Non-Recurring Engineering cost):
    • The one-time monetary cost of designing the system
  • Size:
    • the physical space required by the system
  • Performance:
    • the execution time or throughput of the system
  • Power:
    • the amount of power consumed by the system
  • Flexibility:
    • the ability to change the functionality of the system without incurring heavy NRE cost

Design challenge –

optimizing design metrics

 Common metrics (continued)

  • Time-to-prototype:
    • the time needed to build a working version of the system
  • Time-to-market:
    • the time required to develop a system to the point that it can be released and sold to customers
  • Maintainability:
    • the ability to modify the system after its initial release
  • Correctness, safety, many more

Design metric competition --

improving one may worsen others

 Expertise with both software and hardware is needed to optimize design metrics

  • Not just a hardware or software expert, as is common
  • A designer must be comfortable with various technologies in order to choose the best for a given application and constraints

Performance Size

Power

NRE cost

Microcontroller

A2D CCD preprocessor^ Pixel coprocessor D2A JPEG codec DMA controller Memory controller ISA bus interface UART LCD ctrl

Display ctrl

Multiplier/Accum

Digital camera chip

lens

CCD

Hardware Software

NRE and unit cost metrics

 Costs:

  • Unit cost:
    • the monetary cost of manufacturing each copy of the system, excluding NRE cost
  • NRE cost (Non-Recurring Engineering cost):
    • The one-time monetary cost of designing the system
  • total cost = NRE cost + unit cost * # of units
  • per-product cost = total cost / # of units = (NRE cost / # of units) + unit cost

Losses due to delayed market entry

 Simplified revenue model

  • Product life = 2W, peak at W
  • Time of market entry defines a triangle, representing market penetration
  • Triangle area equals revenue

On-time Delayed entry entry

Peak revenue

Peak revenue from delayed entry

Market rise

Market fall

W 2W Time

D

On-time

Delayed

Revenues ($)

Loss -The difference between the on-time and delayed triangle areas

Losses due to delayed market entry (cont.)

 Area = 1/2 * base * height

  • On-time = 1/2 * 2W * W
  • Delayed = 1/2 * (W-D+W)(W-D)  Percentage revenue loss = (D(3W-D)/2W^2 )100%  Try some examples

On-time Delayed entry entry

Peak revenue

Peak revenue from delayed entry

Market rise

Market fall

W 2W Time

D

On-time

Delayed

Revenues ($)

  • Lifetime 2W=52 wks, delay D=4 wks
    • (4(326 –4)/2*26^2) = 22%
  • Lifetime 2W=52 wks, delay D=10 wks
    • (10(326 –10)/2*26^2) = 50%
  • Delays are costly!

The Performance design metric

 Latency (or response time, or execution time)

  • time to complete one task

 Bandwidth (or throughput)

  • tasks completed per unit time

 Widely-used measure of system, widely-abused

  • Clock frequency, instructions per second – not good measures
  • Digital camera example – a user cares about how fast it processes images, not clock speed or instructions per second

Performance Measurement

Average rate: AAAA > BBBB > CCCC Worst-case rate: AAAA < BBBB < CCCC

Processing Rate (Inputs/Second)

Inputs

C B A

Which is best for desktop performance? _______

Which is best for hard real-time task? _______

Average rates Worst case rates

Power Impacts on Computer System

 Energy consumed per task determines battery life

  • Second order effect is that higher current draws decrease effective battery energy capacity (higher power also lowers battery life)

 Current draw causes IR drops in power supply voltage

  • Requires more power/ground pins to reduce resistance R
  • Requires thick&wide on-chip metal wires or dedicated metal layers

 Switching current (dI/dt) causes inductive power supply voltage bounce ∝ LdI/dt

  • Requires more pins/shorter pins to reduce inductance L
  • Requires on-chip/on-package decoupling capacitance to help bypass pins during switching transients

 Power dissipated as heat, higher temps reduce speed and reliability

  • Requires more expensive packaging and cooling systems
  • Fan noise
  • Laptop/handheld case temperature

Reducing Switching Power

Power ∝ activity * 1/2 CV^2 * frequency

 Reduce activity

 Reduce switched capacitance C

 Reduce supply voltage V

 Reduce frequency

Reducing Activity

Clock Gating

  • don’t clock flip-flop if not needed
  • avoids transitioning downstream logic
  • Pentium-4 has hundreds of gated clocks

Global Clock

Gated Local Clock

Enable

D Q

Latch (transparent on clock low)

Bus Encodings

  • choose encodings that minimize transitions on average (e.g., Gray code for address bus)
  • compression schemes (move fewer bits)

Remove Glitches

  • balance logic paths to avoid glitches during settling
  • use monotonic logic (domino)

Reducing Switched Capacitance

Reduce switched capacitance C

  • Different logic styles (logic, pass transistor, dynamic)
  • Careful transistor sizing
  • Tighter layout
  • Segmented structures

A B C

Bus

Shared bus driven by A or B when sending values to C

Insert switch to isolate bus segment when B sending to C

A B C

Voltage Scaling for Reduced Energy

 Reducing supply voltage by 0.5 improves energy per

transition to 0.25 of original

 Performance is reduced – need to use slower clock

 Can regain performance with parallel architecture

 Alternatively, can trade surplus performance for lower

energy by reducing supply voltage until “just enough”

performance

Dynamic Voltage Scaling

“Just Enough” Performance

 Save energy by reducing frequency and voltage to

minimum necessary (usually done in O.S.)

t=0 Time t=deadline

Frequency

Run slower and just meet deadline

Run fast then stop

frequency (MHz) VDD (V) Chip energy versus frequency for various supply voltages 0 50 100 150 200 250 300 frequency (MHz) VDD (V) Chip energy versus frequency for various supply voltages 2x Reduction in Supply Voltage 4x Reduction in Energy

 - 4. - 3. - 3. - 3. - 2. - 2. - 2. - 2. - 1. - 1.351. - 0.98 1. 
    1. energy per cycle (nJ) - 2. - 2. - 2. - 1. - 1. - 1. - 1. - 1. - 1. - 1. - 1. - 4. [ MIT Scale Vector-Thread Processor, TSMC 0.18μm CMOS process, 2006 ] - 3. - 3. - 3. - 2. - 2. - 2. - 2. - 1.561. - 1.15 1.
    1. energy per cycle (nJ) - 2. - 2. - 2. - 1. - 1. - 1. - 1. - 1. - 1. - 1. - 1.