Download Introduction to Material Science and Engineering - Lecture Notes | MSE 2034 and more Study notes Materials science in PDF only on Docsity!
MSE 2034-0: Introduction to
Materials Science & Engineering
Course Objective...
Introduce fundamental concepts in Materials Science
You will learn about:
- material structure
- how structure dictates properties
- how processing can change structure
This course will help you to:
- use materials properly
- realize new design opportunities with materials
LECTURES
Lecturer: Shashank Priya
Time: 9:05-9:55 M, W, F
Location: Holden Auditorium
Activities:
- Present new material
- Announce reading and homework
- Mid-term and finals* *Make-ups given only for verifiable emergencies. Before ANY ‘make-up’ exam, you MUST swear your reason to be true, and SIGN before Notary Republic. *Discuss potential conflicts beforehand.
Text Website: http://edugen.wiley.com/edugen/class/cls
- (^) Complete solutions to selected problems
- (^) Links to other web resources
- (^) Extended learning objectives
- (^) Self-assessment exercises
Course Website: Go to VT Blackboard!!!
- Syllabus
- Lecture notes
- Grades
COURSE WEBSITES
GRADING
Midterm #1 20%
Material covered: Chapters 1-
Midterm #2 20%
Material covered: Chapters 7-
Final 40%
Material covered: Comprehensive
Homeworks 20%
Chapter 1 - Introduction
- (^) What is materials science?
- (^) Why should we know about it?
- (^) Materials drive our society
- (^) Stone Age
- (^) Bronze Age
- (^) Iron Age
- Now?
- (^) Silicon Age?
- (^) Polymer Age?
Example – Hip Implant
- (^) With age or certain illnesses joints deteriorate. Particularly those with large loads (such as hip). Adapted from Fig. 22.25, Callister 7e.
Chapter 1 - 10
Example – Hip Implant
Adapted from Fig. 22.26, Callister 7e.
Hip Implant
- (^) Key problems to overcome
- (^) fixation agent to hold acetabular cup
- (^) cup lubrication material
- (^) femoral stem – fixing agent (“glue”)
- (^) must avoid any debris in cup Adapted from chapter-opening photograph, Chapter 22, Callister 7e. Femoral Stem Ball Acetabular Cup and Liner
ex: hardness vs structure of steel
- Properties depend on structure Data obtained from Figs. 10.30(a) and 10.32 with 4 wt% C composition, and from Fig. 11.14 and associated discussion, Callister 7e. Micrographs adapted from (a) Fig. 10.19; (b) Fig. 9.30;(c) Fig. 10.33; and (d) Fig. 10.21, Callister 7e. ex: structure vs cooling rate of steel
- Processing can change structure
Structure, Processing, & Properties
Hardness (BHN) Cooling Rate (ºC/s) 100 200 300 400 500 600 0.01 0.1 1 10 100 1000 (d) 30 m (c) 4 m (b) 30 m (a) 30 m
Types of Materials
- (^) Metals:
- (^) Strong, ductile
- high thermal & electrical conductivity
- (^) opaque, reflective.
- (^) Polymers/plastics: Covalent bonding sharing of e’s
- Soft, ductile, low strength, low density
- (^) thermal & electrical insulators
- (^) Optically translucent or transparent.
- (^) Ceramics: ionic bonding (refractory) – compounds of metallic & non-metallic elements (oxides, carbides, nitrides, sulfides) - Brittle, glassy, elastic - (^) non-conducting (insulators)
ELECTRICAL
- Electrical Resistivity of Copper:
- Adding “impurity” atoms to Cu increases resistivity.
- Deforming Cu increases resistivity. Adapted from Fig. 18.8, Callister 7e. (Fig. 18.8 adapted from: J.O. Linde, Ann Physik 5 , 219 (1932); and C.A. Wert and R.M. Thomson, Physics of Solids , 2nd edition, McGraw-Hill Company, New York, 1970.) -200 -100 (^0) T (°C) Cu + 3.32 at%Ni Cu + 2.16 at%Ni deformed Cu + 1.12 at%Ni 1 2 3 4 5 6 Resistivity,
(
- Ohm-m) 0 Cu + 1.12 at%Ni “Pure” Cu
Chapter 1 - 17
THERMAL
- Space Shuttle Tiles: --Silica fiber insulation offers low heat conduction. - Thermal Conductivity of Copper: --It decreases when you add zinc! Adapted from Fig. 19.4W, Callister 6e. (Courtesy of Lockheed Aerospace Ceramics Systems, Sunnyvale, CA) (Note: "W" denotes fig. is on CD-ROM.) Adapted from Fig. 19.4, Callister 7e. (Fig. 19.4 is adapted from Metals Handbook: Properties and Selection: Nonferrous alloys and Pure Metals , Vol. 2, 9th ed., H. Baker, (Managing Editor), American Society for Metals, 1979, p. 315.) Composition (wt% Zinc) Thermal Conductivity (W/m-K) 400 300 200 100 0 0 10 20 30 40 100 m Adapted from chapter- opening photograph, Chapter 19, Callister 7e. (Courtesy of Lockheed Missiles and Space Company, Inc.)
- Transmittance: --Aluminum oxide may be transparent, translucent, or opaque depending on the material structure. Adapted from Fig. 1.2, Callister 7e. (Specimen preparation, P.A. Lessing; photo by S. Tanner.) single crystal polycrystal: low porosity polycrystal: high porosity
OPTICAL
Chapter 1 - 20
DETERIORATIVE
- Stress & Saltwater... --causes cracks! Adapted from chapter-opening photograph, Chapter 17, Callister 7e. (from Marine Corrosion, Causes, and Prevention , John Wiley and Sons, Inc., 1975.) 4 m --material: 7150-T651 Al "alloy" (Zn,Cu,Mg,Zr) Adapted from Fig. 11.26, Callister 7e. (Fig. 11.26 provided courtesy of G.H. Narayanan and A.G. Miller, Boeing Commercial Airplane Company.)
- Heat treatment: slows crack speed in salt water! Adapted from Fig. 11.20(b), R.W. Hertzberg, "Deformation and Fracture Mechanics of Engineering Materials" (4th ed.), p. 505, John Wiley and Sons, 1996. (Original source: Markus O. Speidel, Brown Boveri Co.) “held at 160 ºC for 1 hr before testing” crack speed (m/s)^ increasing load “as-is” 10 - 10
Alloy 7178 tested in saturated aqueous NaCl solution at 23ºC
