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A question and answer format covering various defects in flexible and rigid-flex printed circuit boards. It addresses issues such as solder wicking, attachment problems, marking defects, cleanliness concerns, solder mask and conformal coating issues, and hardware-related defects. The content is structured around ipc standards and includes acceptance criteria for different defect classes, making it a useful resource for quality control and inspection processes in electronics manufacturing. It offers practical insights into identifying and addressing common pcb defects.
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Flexible and Rigid-Flex Printed Circuitry - Solder Wicking - > Defect Class 1, 2, 3 - ANSWER Spacing as a result of solder wicking or plating migration violate minimum electrical clearance Attachment - > Acceptable Class 1 - ANSWER Side overhang of flex 10- 27 Attachment - > Acceptable Class 2,3 - ANSWER Side overhang10- 27 Attachme - ANSWER Wetted solder is visible in 10- 27 Marking - ANSWER Provides both product identification and traceability Marking - Etched - Acceptable Class 1,2,3 - ANSWER Lines of a number or letter may be broken provided the breaks do not make the marking illegible Marking Etched (including hand printing) - Defect Class 1.2.3 - ANSWER Lines forming a character are missing or broken to the extent that the character is not legible or is likely to be confused with another character Marking - Screened | Process Indicator - Class 1,2,3 - ANSWER Lines of a number or letter may be broken (or the ink thin over a portion of Marking - Screened | Defect - Class 1,2,3 - ANSWER Open areas of characters are filled and are not legible, or are likely to be confused with another number or letter Marking - Stamped | Acceptable - Class 1, Process Indicator - Class 2,3 - ANSWER - Marking that has been smeared or blurred but is still legible
Defect- Class 1,2,3 - ANSWER Machine readable code