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IPC J-STD-001GEXAM QUESTIONS.pdf
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Conductor Diameter the outside diameter of wire,stranded or solid, w/o the insulation Wire Diameter the outside diameter of wire, stranded or solid, with insulation if present Disposition The determination of how defects should be treated. Electrical Clearance The minimum spacing between noncommon uninsulated conductors. FOD (Foreign Object Debris) A substance, debris, particulate matter or article alien to the assembly or system. High Voltage
Varies by design and application. Manufacturer (Assembler) Individual, organization, or company responsible for the assembly process and verification operations necessary to ensure full compliance. Objective Evidence Documentation in the form of hard copy, computer data, video, that demonstrates the requirements in the Standard have been met. Process Control A system or method to continually steer an operation in reducing variation in the processes. Proficiency The capability to perform tasks in accordance with the requirements and verification procedures. Solder Destination Side The side of the PCB that the solder flows toward in a plated through-hole application. Solder Source Side The side of the PCB to which solder is applied. Supplier The individual, organization or company which provides the Manufacturer components and/or materials. User
General Assembly Requirements The electrical and mechanical integrity of components and assemblies shall [D1D2D3] be retained after exposure to processes employed during manufacture and assembly Who specifies Acceptance Requirements? The User. If no criteria are specified required or cited then best manufacturing practice applies. J-STD-001 Scope Describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. User Responsibility Identify the class to which assembly is produced. [ ] indicates how a product is handled if standard is not met. Defect condition that affects form, fit or function Process Indicator condition attributable to variation but does not affect form, fit or function. Who defines additional defect categories? User Who identifies defects and process indicators? Manufacturer
Hardware found to be produced with either materials or processes that do not conform are classified as... D1D2D External connection points of devices incorporating magnetic windings that do not meet solderrability requirements are classified as... D1D2D High voltage parts with a potential >= 6kV can have no ... Broken Strands Process control systems and methodologies if established shall be used and are classified as ... N1D2D What shall take precedence over any standard? D1D2D Contract Appendices are only binding when... Required by contract or engineering document Process Validation Inspection is classified as... N1N2D Visual Inspection by sample based inspection or 100% visual inspection is clssified ... N1D2D Illumination of workstations should be at least... 1000 lux
