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An in-depth look into the Chip-on-Board (COB) process and its applications at The Hong Kong Polytechnic University's EIA Stream. Topics covered include COB advantages, process flow, wire bonding, die attach, encapsulation, and various bonding processes. The document also highlights the benefits of using a Wire Wedge Bonder for COB production.
Typology: Lecture notes
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Industrial Design Mechanical Design Electronic Design
Software Design Mechanical Prototyping Molding Design & Development Hardware Prototyping PCB layout & Fabrication Integration Test & Verification Release for Production Product Development Flow
Final Packing & Shipment Product Production Flow Module Testing Module Testing …… Final Product Test Casing Assembly Main PCBA Assembly & Test
Process …… COB Process
