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Silicon Processing part 4-Mechanical Engineering-Project Presentation, Study Guides, Projects, Research of Mechanical Engineering

Bharat Ratna Dr. B. R. Ambedkar UniversityMechanical Engineering

This presentation is for project of Mechanical Engineering course. Project was supervised by Gopi Chopra at Ambedkar University, Delhi. Its main points are: Silicon, Processing, Element, Raw, Materials, Silica, Coal, Furnace, Quartzite, Reduction, Purification

Typology: Study Guides, Projects, Research

2011/2012

Uploaded on 07/19/2012

shanti-sharma
shanti-sharma 🇮🇳

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The Manufacturing Process
Packaging
Silicon metal is usually packaged in large
sacks or wooden boxes weighing up to
3,000 lb.
In powder form, silicon is packaged in 50-lb
plastic pails or paper bags, 500-lb steel
drums or 3,000-lb large sacks or boxes.
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Download Silicon Processing part 4-Mechanical Engineering-Project Presentation and more Study Guides, Projects, Research Mechanical Engineering in PDF only on Docsity!

The Manufacturing Process^ ^ Packaging^ ^ Silicon metal is usually packaged in largesacks^ or^ wooden

boxes^ weighing^ up

to 3,000 lb.  In powder form, silicon is packaged in 50-lbplastic^ pails^ or^ paper

bags,^ 500-lb^ steel drums or 3,000-lb large sacks or boxes.

Applications^ ^ When silicon is purified and doped withelements such as boron, phosphorus andarsenic, it is used as a semiconductor invarious applications.^ Boron Doping^

Boron / PhosphorusDoping

pplications (IC manufacturing)^ ^ Once the silicon is stabilized, it is sliced intovery^ thin^ layers^

and^ polished^ to^ create

a smooth surface.  Each layer is exposed to oxygen at a hightemperature, which creates an oxide film onthe surface.  The silicon is then spun at a high speed totransform^ the^ oxide

coating^ into^ a^ photo- sensitive material.  A photo of the desired circuit configuration isthen transferred onto the surface of the ICusing a projection lens, in a process known asphotolithography.