Cork Institute of Technology
Bachelor of Engineering (Honours) in Electronic Engineering – Award
(Bachelor of Engineering in Electronic Engineering – Award)
(NFQ – Level 8)
Summer 2005
Elective: Systems Integration
(Time: 2 Hours)
Please answer any four questions.
All questions carry equal marks.
Examiners: Dr. J. J. Barrett
Prof. C. Burkley
Mr. J. Ryan
Question 1. “Packaging”
(a) Why has plastic packaging, long considered to be only suitable for “low reliability”
applications, come to be the most widely used form of IC packaging even for many “high
reliability” applications? (10 marks)
(b) Describe the IC packaging technology used in one of the electronic products which you
have studied and discuss why this technology is appropriate for the particular product.
(15 marks)
Question 2. “Circuit boards”
(a) What is “System in a Package” (SIP) and what are the systems integration challenges
which SIP presents? (10 marks)
(b) Describe the circuit board technology used in one of the electronic products which you
have studied and discuss why this technology is appropriate for the particular product.
(15 marks)
Question 3. “Thermal”
(a) In the case of very large electronic systems, thermal design must be considered at every
level from each individual component up to room/building level. Taking the example of
telecom cabinets, discuss how an integrated system-wide approach to thermal design is
essential for successful system development and operation.
(10 marks)
(b) Describe the cooling technology used in one of the electronic products which you have
studied and discuss why this technology is appropriate for the particular product.
(15 marks)
