IPC j-std-001G complete study guide solution
Conductor Diameter
the outside diameter of wire, stranded or solid, w/o the insulation
Wire Diameter
the outside diameter of wire, stranded or solid, with insulation if present
Disposition
The determination of how defects should be treated.
Electrical Clearance
The minimum spacing between noncommon uninsulated conductors.
FOD (Foreign Object Debris)
A substance, debris, particulate matter or article alien to the assembly or system.
High Voltage
Varies by design and application.
Manufacturer (Assembler)
Individual, organization, or company responsible for the assembly process and verification
operations necessary to ensure full compliance.
Objective Evidence
Documentation in the form of hard copy, computer data, video, that demonstrates the
requirements in the Standard have been met.
Process Control
A system or method to continually steer an operation in reducing variation in the processes.
Proficiency
The capability to perform tasks in accordance with the requirements and verification
procedures.
Solder Destination Side
The side of the PCB that the solder flows toward in a plated through-hole application.
Solder Source Side
The side of the PCB to which solder is applied.
