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A comprehensive set of questions and answers related to j-std (joint electron device engineering council standards) and ipc (the institute for interconnecting and packaging electronic circuits) standards. It covers various aspects of electronics manufacturing, including electronics classes, defect criteria, soldering processes, flux types, and component handling. The questions address key concepts and requirements within these standards, making it a valuable resource for students and professionals in the electronics industry. It also includes information on lead-free solder, gold removal processes, and acceptable component flaws, offering practical insights into quality control and compliance in electronics assembly. Useful for understanding the nuances of electronics manufacturing standards.
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IPC stands for... - Answer - The Institute for Interconnecting and Packaging Electronic Circuits 1.3 - Class 1 Electronics - Answer - General Electronics Product ~$1-$100 value 1.3 - Class 2 Electronics - Answer - Dedicated Service Electronic Products ~$100-$20, 1.3 - Class 3 Electronics - Answer - High Performance/Harsh Environment Products ~$20,000 and up 1.5 - What does NAPD stand for? - Answer - No Standard Exists Acceptable Process Departure, needs corrected Defect 1.5 - A1P2D3 - Answer - Class 1 Acceptable Class 2 Process Departure Class 3 Defect 1.5 - N1D2D3 - Answer - Class 1 No Standard Exists Class 2 Defect Class 3 Defect 1.5 - D1D2D3 - Answer - Class 1 Defect Class 2 Defect Class 3 Defect 1.7.1 - Conflict between J-STD Text and applicable document cited in J-STD, which takes precedent? - Answer - J-STD text 1.7.1 - Conflict between J-STD Text and assembly drawing/documentation not approved by User, which takes precedent? - Answer - J-STD 1.7.1 - Conflict between J-STD Text and assembly drawing/documentation approved by User, which takes precedent? - Answer - Assembly Drawing or Documentation 1.8.3 - What does FOD stand for? - Answer - Foreign Object Debris 1.8.12 - Define "User" - Answer - The Individual, Organization, company, or designated authority responsible for procurement or design.
1.8.13 - Wire Overwrap - Answer - Wire wraps around terminal more than 360 degrees and remains in contact. 1.9 - If a condition is considered a Defect for Class 3, this means Class 1 and 2... - Answer - May still be usable. 1.9 - If a condition is considered a Defect for Class 1, this means Class 3 and 2... - Answer - Will also be a defect 1.9 - Requirements Flow down - If J-STD is contractually required then... - Answer - the requirements shall be imposed on subassembly drawings, PO's, and subcontracts. 1.9 - Design and workmanship of COTS items should be... - Answer - evaluated and modified as required to ensure end item meets contract performance standards. 1.9 - What does COTS stand for? - Answer - Commercial Off The Shelf 1.13.2.3 - There Shall be no broken strands for wires used at a potential of... - Answer - 6kV or greater 3.2.1 - Lead Free solder contains... - Answer - Less than 0.1% Pb (Lead) 3.2.2 - Sn60Pb40 - Answer - 60% tin 40% Lead 3.2.2 - Sn62Pb36Ag2 - Answer - 62% tin 36% lead 2% silver 3.2.2 - Sn63Pb37 - Answer - 63% tin 37% lead 3.2.2 - Solder used for preconditioning, gold removal, tinning of parts, or machine soldering shall... - Answer - Be analyzed, replaced, or replenished at a frequency that to ensure compliance. 3.2.2 - If contamination exceeds the limits ... - Answer - intervals between analysis, replacement or replenishment shall be shortened. 3.2.2 - Records containing the results of all analyses and solder bath usage shall be maintained for... - Answer - A minimum of 1 year for each process/system 3.3 - Flux shall conform to Flux activity levels ... - Answer - L0 and L1 of flux materials RO, RE, OR, except ORL1 shall not be used for no-clean soldering. 3.3 - RO Flux - Answer - Rosin Flux 3.3 - RE Flux - Answer - Resin Flux 3.3 - OR Flux - Answer - Organic Flux