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END OF IPC stands for... - ANSWERS-The Institute for Interconnecting and Packaging Electronic Circuits 1.3 - Class 1 Electronics - ANSWERS-General Electronics Product ~$1- $100 value 1.3 - Class 2 Electronics - ANSWERS-Dedicated Service Electronic Products ~$100-$20, 1.3 - Class 3 Electronics - ANSWERS-High Performance/Harsh Environment Products ~$20,000 and up 1.5 - What does NAPD stand for? - ANSWERS-No Standard Exists Acceptable Process Departure, needs corrected Defect 1.5 - A1P2D3 - ANSWERS-Class 1 Acceptable Class 2 Process Departure
END OF Class 3 Defect 1.5 - N1D2D3 - ANSWERS-Class 1 No Standard Exists Class 2 Defect Class 3 Defect 1.5 - D1D2D3 - ANSWERS-Class 1 Defect Class 2 Defect Class 3 Defect 1.7.1 - Conflict between J-STD Text and applicable document cited in J- STD, which takes precedent? - ANSWERS-J-STD text 1.7.1 - Conflict between J-STD Text and assembly drawing/documentation not approved by User, which takes precedent? - ANSWERS-J-STD 1.7.1 - Conflict between J-STD Text and assembly drawing/documentation approved by User, which takes precedent? - ANSWERS-Assembly Drawing or Documentation
END OF 1.9 - What does COTS stand for? - ANSWERS-Commercial Off The Shelf 1.13.2.3 - There Shall be no broken strands for wires used at a potential of... - ANSWERS-6kV or greater 3.2.1 - Lead Free solder contains... - ANSWERS-Less than 0.1% Pb (Lead) 3.2.2 - Sn60Pb40 - ANSWERS-60% tin 40% Lead 3.2.2 - Sn62Pb36Ag2 - ANSWERS-62% tin 36% lead 2% silver 3.2.2 - Sn63Pb37 - ANSWERS-63% tin 37% lead 3.2.2 - Solder used for preconditioning, gold removal, tinning of parts, or machine soldering shall... - ANSWERS-Be analyzed, replaced, or replenished at a frequency that to ensure compliance. 3.2.2 - If contamination exceeds the limits ... - ANSWERS-intervals between analysis, replacement or replenishment shall be shortened.
END OF 3.2.2 - Records containing the results of all analyses and solder bath usage shall be maintained for... - ANSWERS-A minimum of 1 year for each process/system 3.3 - Flux shall conform to Flux activity levels ... - ANSWERS-L0 and L1 of flux materials RO, RE, OR, except ORL1 shall not be used for no- clean soldering. 3.3 - RO Flux - ANSWERS-Rosin Flux 3.3 - RE Flux - ANSWERS-Resin Flux 3.3 - OR Flux - ANSWERS-Organic Flux 3.3.1 - When external flux is used with flux cored solder the fluxes shall be... - ANSWERS-compatible both from cleaning process standpoint and chemical standpoint. 3.8.1 - Minor surface flaws, discoloration, meniscus cracks, or chips in component bodies are... - ANSWERS-Acceptable, however they shall
END OF 4.5.1 - Gold must be removed from at least... - ANSWERS-95% of all the surfaces to be soldered of all through-hole components to be hand soldered. 4.5.1 - Gold must be removed from at least... - ANSWERS-95% of all the surface mounted components regardless off gold thickness 4.5.1 - Gold must be removed from at least... - ANSWERS-95% of all the surfaces to be soldered of through-hole components with >2.54 um gold thickness. 4.5.1 - Double tinning process or dynamic solderwave maybe be used for... - ANSWERS-Gold Removal prior to mount components. 4.5.1 - Gold embrittlement can occur regardless ofgold thickness when...
- ANSWERS-Solder volume is low or dwell time is not sufficient.
