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J-STD Quiz Comprehensive Questions
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Answers
IPC stands for... - Answer: The Institute for Interconnecting and Packaging Electronic Circuits 1.3 - Class 1 Electronics - Answer: General Electronics Product ~$1-$100 value 1.3 - Class 2 Electronics - Answer: Dedicated Service Electronic Products ~$100-$20, 1.3 - Class 3 Electronics - Answer: High Performance/Harsh Environment Products ~$20,000 and up 1.5 - What does NAPD stand for? - Answer: No Standard Exists Acceptable Process Departure, needs corrected Defect 1.5 - A1P2D3 - Answer: Class 1 Acceptable Class 2 Process Departure Class 3 Defect 1.5 - N1D2D3 - Answer: Class 1 No Standard Exists Class 2 Defect Class 3 Defect
1.5 - D1D2D3 - Answer: Class 1 Defect Class 2 Defect Class 3 Defect 1.7.1 - Conflict between J-STD Text and applicable document cited in J-STD, which takes precedent? - Answer: J-STD text 1.7.1 - Conflict between J-STD Text and assembly drawing/documentation not approved by User, which takes precedent? - Answer: J-STD 1.7.1 - Conflict between J-STD Text and assembly drawing/documentation approved by User, which takes precedent? - Answer: Assembly Drawing or Documentation 1.8.3 - What does FOD stand for? - Answer: Foreign Object Debris 1.8.12 - Define "User" - Answer: The Individual, Organization, company, or designated authority responsible for procurement or design. 1.8.13 - Wire Overwrap - Answer: Wire wraps around terminal more than 360 degrees and remains in contact. 1.9 - If a condition is considered a Defect for Class 3, this means Class 1 and 2... - Answer: May still be usable. 1.9 - If a condition is considered a Defect for Class 1, this means Class 3 and 2... - Answer: Will also be a defect
3.3 - Flux shall conform to Flux activity levels ... - Answer: L0 and L1 of flux materials RO, RE, OR, except ORL1 shall not be used for no-clean soldering. 3.3 - RO Flux - Answer: Rosin Flux 3.3 - RE Flux - Answer: Resin Flux 3.3 - OR Flux - Answer: Organic Flux 3.3.1 - When external flux is used with flux cored solder the fluxes shall be... - Answer: compatible both from cleaning process standpoint and chemical standpoint. 3.8.1 - Minor surface flaws, discoloration, meniscus cracks, or chips in component bodies are... - Answer: Acceptable, however they shall not expose the component substrate or active element nor affect structural integrity. 3.8.1 - Components shall not be... - Answer: Charred or have damage in excess of that to be determined to be a minor surface flaw that degrades the component below the Spec Requirements or affects Form, Fit, Function. 3.8.1 - Loss of metallization as a result of processing Shall: (3 points) - Answer: -Not expose ceramic on the terminal end face.
- Be no greater than 25% of width or thickness of any termination side -Be no more than 50% on top of a 5 or 3 sided termination component 3.9 - A tool used to cut leads Shall Not... - Answer: Impart shock that damages a component lead seal or internal connection.
4.5 - For Electroless Nickel Immersion Gold (ENIG) Nickel-palladium-gold (NiPdAu), or Electro Nickeless Palladium Immersion Gold (ENEPIG) are exempt from... - Answer: Finish Removal Requirements in 4.5.1 and 4.5. 4.5.1 - Gold must be removed from at least... - Answer: 95% of all the surfaces to be soldered of all through-hole components to be hand soldered. 4.5.1 - Gold must be removed from at least... - Answer: 95% of all the surface mounted components regardless off gold thickness 4.5.1 - Gold must be removed from at least... - Answer: 95% of all the surfaces to be soldered of through-hole components with >2.54 um gold thickness. 4.5.1 - Double tinning process or dynamic solderwave maybe be used for... - Answer: Gold Removal prior to mount components. 4.5.1 - Gold embrittlement can occur regardless ofgold thickness when... - Answer: Solder volume is low or dwell time is not sufficient.
