Transit and Settling Time - Computational Methods - Lecture Slides, Slides of Calculus for Engineers

These are the Lecture Slides of Computational Methods which includes Thévenin’s Equivalent Circuit, Circuit Simplification, Analysis of Power Transfer, Voltage Division, Analytical Game Plan, Array Operation, Element Operations, Number of Allowable Values etc.Key important points are: Transit and Settling Time, Antivibration Table, Accelerometer Output, Full Cross-Wafer, Accelerometer Specifications, Stage Transit-Time Model, Transit-Time Vs Transit-Distance, Program System for Die Jumps

Typology: Slides

2012/2013

Uploaded on 03/26/2013

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3x00 XY-Stage
Transit/Settling Time
Engr/Math/Physics 25
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3x00 XY-Stage

Transit/Settling Time

Engr/Math/Physics 25

Executive Summary

  • Test Procedure
    • Attach Accelerometer to 3xxx Stage
    • Move Stage in Short, Medium, Long Runs
    • Record Accelerometer OutPut With Oscope
  • Estimated SETTLING TIME: <15ms
  • Olympus Stage Transit-Time Model
    • d ≡ Travel Distance in mm
    • T (^) t ≡ Transit Time in mS

T = [ 4. 37 mS mm] ⋅ d + 46. 5 mS

t

Test Design

  • Attach Accelerometer to XY-Stage
  • Measure Accelerometer Output w/ Oscope
  • Program System for Die Jumps on 200mm wafer

with KLARRF Map Die Patterns

  • X-Pitch = 7.8408280000e+03 μm (7.8408 mm)
  • Y-Pitch = 1.4138693000e+04 μm (14.1387 mm)
  • Die Jumps: L↔R, T↔B, UL↔LR, UR↔LL
  • Full Cross-Wafer (long) Moves
  • 4-Die Moves
  • Single-Die Moves

Stage-Move Profiles – 200mm Wafer

LEGEND

LONG MOVE

4-DIE MOVE

SINGLE-DIE MOVE

174.4 mm

12.7mm

50.9 mm

AVG. DISTANCE

Results & Analysis

cont.

  • Max Z-Acceleration = 5.92g
  • Y-Axis “Rattles” about 4-TIMES More than the

X-Axis

OTA-3220 Stage Transit-Time Test • Oct

t = 4.3725d + 46. R^2 = 0.

0

100

200

300

400

500

600

700

800

900

0 20 40 60 80 100 120 140 160 180

Stage Travel Distance (mm)
Stage Travel Time (mS)
Travel-Time (mS)

file = OTA3200_Stage-Settling_Time_0210.XLS

Velocity/Slope = 229 mm/S

OTA-3220 Stage Settling • Single-Die UR-Diag Move

0

50

100

150

200

250

300

350

400

-0.04 -0.02 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.

Time (s)
AcceleroMeter Output (mVdc)
Vlo (Vdc)
Vhi (Vdc)

file = OTA3200_Stage-Settling_Time_0210.XLS

OTA-3220 Stage Settling • Single-Die +y Move

0

50

100

150

200

250

-0.04 -0.02 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.

Time (s)
AcceleroMeter Output (mVdc)
Vlo (Vdc)
Vhi (Vdc)
Lt Boundary
Rt boundary

file = OTA3200_Stage-Settling_Time_0210.XLS

Settling time = ~12.8ms
OTA-3220 Stage Settling • Single-Die DIAG-LR Move

0

50

100

150

200

250

-0.04 -0.02 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.

Time (s)
AcceleroMeter Output (mVdc)
Vlo (Vdc)
Vhi (Vdc)
Lt Boundary
Rt boundary

file = OTA3200_Stage-Settling_Time_0210.XLS

Settling time = ~14.4ms
OTA-3220 Stage Settling • Single-Die DIAG-LR Move

0

20

40

60

80

0.110 0.115 0.120 0.125 0.130 0.135 0.

Time (s)
AcceleroMeter Output (mVdc)
Vlo (Vdc)
Vhi (Vdc)
Lt Boundary
Rt boundary

file = OTA3200_Stage-Settling_Time_0210.XLS

Settling time = ~14.

AcceleroMeter Specifications

KLARFF Map Details

FileVersion 1 1;
FileTimestamp 08-22-02 13:33:54;
InspectionStationID "NONE" "BITMAP" "ORB102";
SampleType WAFER;
ResultTimestamp 08-22-02 10:14:55;
LotID "QT96B2815340_3";
SampleSize 1 200;
SetupID "T96B_UP" 05-08-02 07:02:28;
StepID "RTP_ANNEAL_2";
SampleOrientationMarkType NOTCH;
OrientationMarkLocation UP;
DiePitch 7.8408280000e+03 1.4138693000e+04;
DieOrigin 0.0000000000e+00 0.0000000000e+00;
WaferID "01";
Slot 1;
SampleCenterLocation 4.3974690000e+03 7.8404710000e+03;