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This lecture was delivered by Prof. Bhanudas Jayaraman at Aligarh Muslim University. This lecture is about workshop of Mechanical Engineering course. Its main points are: Welding, Workshop, Soldering, Joining, Process, Filler, Metal, Capillary, Attraction, Assembling, Electronics
Typology: Slides
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ProductionTechnology
Shaping
Joining
Finishing
Machining
Fastening
Welding
SurfaceTreatment
PackingAndShipping
Forming
Soldering:
A joining process by which a
joint is produced by heating, generallybelow 800°F and using a nonferrous fillermetal that has a melting point below thatof the base metals. The filler metal isdistributed between the properly fittedparts by capillary attraction.
Soldering Application in Electronics
Soldering Equipments
Solder
and lead, respectively:
50/50: melts between 185–215 °C (365–419 °F)
identical to soldering except that thejoining takes place at temperatures above840 °F. The filler metal is distributedbetween closely fitted surfaces of the jointby capillary attraction.
soldered joints.
assembly to suitable temperatures and byusing a filler metal having a liquidus above450 °C (840 °F) and below the solidus ofthe base metals. The filler metal isdistributed between the closely fittedsurfaces of the joint by capillary attraction.
Brazing Equipments
Flux
A braze joint