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Material Type: Assignment; Professor: Grantner; Class: Digital Electronics; Subject: Electrical & Computer Engineer; University: Western Michigan University; Term: Spring 2006;
Typology: Assignments
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Bonus Essay Assignment # 3% of course grade Due 9:00am, Friday, April 21, 2006
Write an essay to answer the questions raised in the problem statement below. It must be of minimum two pages long but not longer than three pages. If any resource is used to write your answer it must be properly referred to. The page set up is as follows: 1” margins, 12 pt fonts (Times New Roman), single line space.
Allowing Defective Chips To Go To Market
by Jeremy Hanzlik
Texas A & M University College Station, TX 77843
Introduction
A production line engineer, Shane, checks every chip for quality control (QC). His workers find errors approximately every 150 chips. Either the defective chips must be sent back for repair or they must be axed (thrown away). The manager, Rob, has mandated that workers must axe all defective chips. Rob walks over to Shane's line and declares, "Why some lines sink more dollars into a chip that's failed, I don't understand. We only make 25 cents off of each chip anyway! Spending an additional $2.00 per chip will only be more money down the drain. Shane, in our line of work we can't afford to flush money down the toilet."
The following afternoon, Rob calls a meeting in his office. Rob informs Shane, that Shane's line is axing too many chips. "One chip every hundred and fifty is unacceptable! This is becoming a substantial cost to the company. I believe that it would be more beneficial to allow defective chips to go out the door." Shane asks, "What about the defective chips? Won't customers complain?" Rob replies, "Yeah, yeah, but that's not your problem, the company has a return department that will replace them as customers complain." Rob further estimates that allowing defective chips on the market will yield a $416,000 profit for the company.
Facts:
Additional information regarding the Shane's line:
The engineer's line consists of the final inspection between the bond wires, which attach the chips to the prongs and spot plates (the prongs that protrude from the final product), just before the chips are encased in molding compound for final packaging. You may assume that all defects are caused by faulty bond wire attachment and not by any problem with the chip itself, because the chips were tested in the preceding phase before the bond wires were attached.
Numerical Problems
Questions on Ethics and Professionalism
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Reference: IEEE Code of Ethics http://www.ieee.org/web/membership/ethics/code_ethics.html