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The solutions to homework 2 of the microelectronics technology course (ecse-2210) at a specific university. It covers calculations related to carrier concentrations (electron density, hole density, and intrinsic carrier density) at various temperatures. Students can use this document to check their understanding of the concepts and equations presented in the course.
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ECSE-2210 Microelectronics Technology Homework 2 – Solution
At 300 K, n = 10 17 cm–3^ , n i = 10 10 cm–3^ , p = 10 3 cm–
At 200 K, n = 10 17 cm–3^ , n i = 10 5 cm–3^ , p = 10 -7^ cm–
That is, the hole concentration at 200 K is extremely small. You will find only one hole in a volume of 10^7 cm^3 of Si!
n = N D = 1015 cm–
p = n i 2 / N D = 10^5 cm–
b) Since N D << N A, N A >> n i
p = N A = 1016 cm–
n = n i 2 / N A = 10 4 cm–
c) Here we must retain both N D and N A, but N D- N A >> n i
n = N D – N A = 1015 cm–
p = n i 2 / ( N D – N A) = 10 5 cm–
d) We deduce from Figure 2.20 that, at 450 K, n i (Si) ≈ 5 × 10 13 cm–3^. Clearly, n i is comparable to N D and we must use Eq. 2.29a
n = N D /2 + [ ( N D /2) + n i 2 ] 1/2^ = 1.21 × 10^14 cm–
p = n i 2 / n = 2.07 × 10^13 cm–
e) We conclude from figure 2.20, that at 650 K, n i = 10 16 cm–3^ Here n i >> N D
p = n i = 1016 cm–
n = n i = 10^16 cm–