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A detailed overview of defect analysis and acceptability criteria for flexible and rigid-flex printed circuitry. It covers various aspects such as solder wicking, attachment, marking, cleanliness, solder mask coating, conformal coating, potting material, swaged hardware, insulation, conductor strands, and wire overwrap. Acceptable and defect conditions for different classes of products, offering valuable insights for quality control and manufacturing processes in electronics.
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Flexible and Rigid-Flex Printed Circuitry - Solder Wicking - > Defect Class 1, 2, 3 - ANSWER Spacing as a result of solder wicking or plating migration violate minimum electrical clearance Attachment - > Acceptable Class 1 - ANSWER Side overhang of flex 10- 27 Attachment - > Acceptable Class 2,3 - ANSWER Side overhang10- 27 Attachme - ANSWER Wetted solder is visible in 10- 27 Marking - ANSWER Provides both product identification and traceability Marking - Etched - Acceptable Class 1,2,3 - ANSWER Lines of a number or letter may be broken provided the breaks do not make the marking illegible Marking Etched (including hand printing) - Defect Class 1.2.3 - ANSWER Lines forming a character are missing or broken to the extent that the character is not legible or is likely to be confused with another character Marking - Screened | Process Indicator - Class 1,2,3 - ANSWER Lines of a number or letter may be broken (or the ink thin over a portion of Marking - Screened | Defect - Class 1,2,3 - ANSWER Open areas of characters are filled and are not legible, or are likely to be confused with another number or letter Marking - Stamped | Acceptable - Class 1, Process Indicator - Class 2,3 - ANSWER - Marking that has been smeared or blurred but is still legible