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Manual Completo de MEMÓRIA: DRAM, SRAM, EPROM e Flash Memory ICs (1997), Notas de estudo de Automação

Este documento oferece cobertura completa de dram, sram, eprom e flash memory ics, abordando o mercado, tecnologia e tendências de cada tipo de memória. Além disso, inclui um glossário de termos e um apêndice sobre memória de alta densidade.

Tipologia: Notas de estudo

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MEMORY
1997
ICE Staff Contributors:
Brian Matas
Christian de Suberbasaux
Complete Coverage of
DRAM, SRAM, EPROM,
and Flash Memory ICs.
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Section 2. The DRAM MarketSection 1. The MOS Memory Market
Section 3. The SRAM Market Section 4. The EPROM Market
Section 5. The Flash Memory Market Section 6. General Memory
Technology Trends
Section 7. DRAM Technology Section 8. SRAM Technology
Section 9. ROM, EPROM,
and EEPROM Technology Section 10. Flash Memory Technology
Section 11. Embedded Memory Section 12. Glossary of Terms
Section 13. High Density DRAM, SRAM,
EPROM, and Flash Memory Appendix Table of Contents and
List of Illustrations
pf2

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MEMORY 1997

ICE Staff Contributors:

Brian Matas

Christian de Suberbasaux

Complete Coverage of

DRAM, SRAM, EPROM,

and Flash Memory ICs.

®

e S

v r i^ n

g

th

e

Gl

ob

al

Sem

iconductor Ind us tr y Si nc (^) e 91 46

Section 1. The MOS Memory Market Section 2. The DRAM Market

Section 3. The SRAM Market Section 4. The EPROM Market

Section 5. The Flash Memory Market

Section 6. General Memory

Technology Trends

Section 7. DRAM Technology Section 8. SRAM Technology

Section 9. ROM, EPROM,

and EEPROM Technology

Section 10. Flash Memory Technology

Section 11. Embedded Memory Section 12. Glossary of Terms

Section 13. High Density DRAM, SRAM,

EPROM, and Flash Memory Appendix

Table of Contents and

List of Illustrations

© 1997 Integrated Circuit Engineering Corporation

The information on devices or arrangements contained in this text may be cov- ered by patents. The disclosure of any information herein does not convey any license and no liability for patent infringement arising out of the information is assumed.

The information and data contained herein have been compiled from govern- ment and non-government technical reports and from material supplied by various manufacturers and are intended to be used for reference purposes. ICE does not warrant the accuracy of this information and data. The user is further cautioned that the data contained herein may not be used in lieu of other con- tractually cited references and specifications.

All rights reserved. No part of this publication may be reproduced in any form, or by any means without permission in writing from Integrated Circuit Engineering Corporation, 15022 N. 75th Street, Scottsdale, AZ 85260.

ISBN: 1-877750-59-X

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