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A question and answer format overview of key concepts related to the ipc-a-610 standard for electronics manufacturing. It covers topics such as product classes, defect conditions, soldering, conformal coating, and electrostatic discharge (esd) prevention. It is useful for individuals seeking certification or a better understanding of electronics assembly acceptance criteria. The document also includes information on inspection methodology, certification programs, and material handling.
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Class 1 Product - ANSWER General Electronics Product - includes products where the major requirement is function of the completed assembly. Class 2 Product - ANSWER Dedicated Service Electronic Product - Continued performance and extended life required. Uninterrupted service is desired but not required. Class 3 Product - ANSWER High Performance Electrical Product - Continued high performance or performance-on-demand is critical. Equipment downtime cannot be tolerated. Equipment might be used for life-support or other critical systems. Who as the ultimate responsibility for identifying the class to which the assembly is evaluated? - ANSWER The Customer. Shall - ANSWER Invokes a requirement for manufacturers of all classes or product, and failure to comply with the requirement is a noncompliance to this standard. Order of Precedence in event of conflict 1 - ANSWER 1. Procurement as agreed and documented between customer and supplier. Order of Precedence in event of conflict 2 - ANSWER Master drawing or master ass. drawing reflecting the customer's detailed requirements. Order of Precedence in event of conflict 3 - ANSWER IPC- 1 - 610 when invoked by the customer or contract. If documents other than IPC-A-610 are cited, the order of precedence shall be defined in the _ - ANSWER Procurement documents Target Condition - ANSWER A condition that is close to perfect, but is not always achievable and may not be necessary to ensure the reliability of the assembly. Acceptable Condition - ANSWER A condition that, while not necessarily perfect, will maintain integrity and reliability of the assembly Defect Condition - ANSWER The form, fit or function of the assembly is inadequate for use in its end use environment. A defect for Class 1... - ANSWER automatically implies a defect for Class 2 and 3. A defect for Class 2 implies a defect for Class 3.
Disposition - ANSWER The determination of how defects should be treated. These include rework, use as is, scrap, and repair. Who dispositions defect conditions? - ANSWER The manufacturer, based on design, service and customer requirements. Process Indicator Conditions - ANSWER A condition (not a defect) that does not affect the form, fit or function of a product. Process indicators should be... - ANSWER monitored as part of the process control system Is disposition of individual process indicators required? - ANSWER No, and affected products should be used as-is. Conditions Not Specified - ANSWER A condition that is neither a defect, nor a process indicator. A condition not specified may be considered acceptable unless it can be established that the condition affects user-defined form, fit or function. Primary Side - ANSWER The side of a packaging or interconnecting structure (PCB) defined as primary on the master drawing. This is usually the side with the most complex or greatest number of components. The Primary Side is also known as... - ANSWER the component side, or the solder destination side (in through-hole mounting technology). Solder source side - ANSWER The side of the PCB to which solder is applied. This is usually the secondary side, but might be the primary side in some cases. Solder Destination Side - ANSWER The side of the PCB that the solder flows toward in through-hole technology. The destination is is normally the primary side of the PCB, but might be the secondary side in some cases. Cold Solder Connection - ANSWER A solder connection that exhibits poor wetting and that is characterized by a grayish porous appearance. What can cause a cold solder connection? - ANSWER Excessive impurities in the solder, inadequate cleaning prior to the soldering, and/or insufficient application of heat during the soldering process. Any violation of minimal electrical clearance is a... - ANSWER defect condition for all classes.
Antistatic (low charging) packaging materials - ANSWER Used to provide inexpensive cushioning and intermediate packaging for ESD sensitive (ESDS) items. Are eating, drinking or use of tobacco products in the work area permitted? - ANSWER No. Should work areas be kept clean and neat? - ANSWER Yes. What are typical contaminants that might cause soldering and coating problems?
Materials authorized for reproduction by the user will be so identified and provided by IPC in ____ format, e.g. student training materials (previously called student handbooks) - ANSWER electronic An applicant who completes the training course but fails to pass the certification measurement criteria can retest not sooner than 24 hours nor more than _ days following the original testing, except as authorized in writing by IPC's director of certification. - ANSWER 90 Who do you swear to? - ANSWER BATMAN 3 types of Conformal Coating: Acrylic Resin (AR) - ANSWER This type of coating provides FAIR elasticity and general protection. It has high dielectric strength, and fair moisture and abrasion resistance. This coating is different from others because its facility for removal. This type are EASILY and quickly removed by a variety of solvents, often without requiring agitation. This makes rework and field repair very practical and economical. This type doesn't protect against solvents and solvent vapors. 3 types of Conformal Coating: Silicone Resin (SR) - ANSWER This type of coating provides EXCELLENT protection in a very wide temperature range. This coating provides good chemical resistance, moisture, and salt spray resistance, and is very flexible. This type is NOT abrasion resistant because of its rubbery nature, but this property does make it resilient against vibrational stresses. Commonly used in high-humidity environments. Removal can be CHALLENGING. requiring specialized solvents, long soak time, and agitation from a brush. 3 types of Conformal Coating: Urethane (Polyurethane) Resin (UR) - ANSWER This type of coating is known for its EXCELLENT moisture and chemical resistance. It is also very abrasion resistant. Combining those factors with its SOLVENT RESISTANCE results in a conformal coating that is very difficult to remove. Like SR, full removal generally requires special solvents, long soak time, and agitation with a brush. This is common in aerospace application. ex: Conathane 5 Coating application methods: Manual Spraying - ANSWER Aerosol can or handheld spray gun. Time consuming method of coating for a small quantity of boards. Lots of masking beforehand. Quality and consistency of outcome are operator- dependent. 5 Coating application methods: Automated spraying - ANSWER Programmed spray system that moves the board on a CONVEYOR under an alternative spray head that applies a conformal coating.
(6) Most Common Coating Defects and causes: Delamination - ANSWER When coating has lifted up and away from the board. This hinders protection because the area below the coating is left exposed. (Ex:Ripping off more coating after demasking and pulling off too much coating around the area. Causes:
Wet Film Wheel - ANSWER Method to measure wet coating using two outer wheels fixed to a central spindle wheel. Thickness is measured by rolling the wheel on the maximum scale towards accurately ground zero. When rolling the wheel on the coated board, the central wheel will touch the coating. The first point of contact on the central wheel determines the wet film thickness. Measling - ANSWER Internal condition occurring in laminated base material in which the glass fibers are separated from the resin at the weave intersection. This condition manifests itself in the form of discrete white spots or crosses below the surface of the base material, and is usually related to THERMALLY INDUCED STRESS. Crazing - ANSWER Internal condition occurring in the laminated base material in which the glass fibers are separated from the resin at the weave intersections. This condition manifests itself in the form of CONNECTED white spots or crosses below the surface of the base material and usually related to MECHANICALLY INDUCED STRESS. Blistering - ANSWER Delamination in the form of a localized swelling and separation between any of the layers of a lamination base material, or between base material and conductive foil or protective coating. Delamination - ANSWER Separation between plies within base material, between a base material and a conductive foil or any other planar separation within a printed board. Weave Texture - ANSWER Surface condition of a base material in which a weave pattern of glass cloth is apparent although the unbroken fibers are completely covered with resin. Weave Exposure - ANSWER Surface condition of a base material in which the unbroken fibers of woven glass cloth are NOT completely covered by resin. Haloing - ANSWER condition existing in the base material in the form of a light area around holes or other machined areas on or below the surface of the base material. Mechanically induced fracturing or delamination on or below the surface of the base material; a Light area around the holes, other machined areas or both. (a light ring around a hole on a circuit board) FOD (Foreign Object Debris) - ANSWER A generic term for a substance, debris, particulate matter or article alien to the assembly or system. ex: wire and lead clippings, hair, dust, non-ESD safe objects. Solder Mask Coating - ANSWER Heat-resisting coating material applied to selected areas to prevent the deposition of solder upon those areas during