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IPC |stands |for... |- |CORRECT |ANSWER✔✔-The |Institute |for |Interconnecting |and | Packaging |Electronic |Circuits 1.3 |- |Class | 1 |Electronics |- |CORRECT |ANSWER✔✔-General |Electronics |Product | ~$1-$100 |value 1.3 |- |Class | 2 |Electronics |- |CORRECT |ANSWER✔✔-Dedicated |Service |Electronic | Products ~$100-$20, 1.3 |- |Class | 3 |Electronics |- |CORRECT |ANSWER✔✔-High |Performance/Harsh | Environment |Products ~$20,000 |and |up 1.5 |- |What |does |NAPD |stand |for? |- |CORRECT |ANSWER✔✔-No |Standard |Exists Acceptable Process |Departure, |needs |corrected Defect 1.5 |- |A1P2D3 |- |CORRECT |ANSWER✔✔-Class | 1 |Acceptable Class | 2 |Process |Departure Class | 3 |Defect
1.5 |- |N1D2D3 |- |CORRECT |ANSWER✔✔-Class | 1 |No |Standard |Exists Class | 2 |Defect Class | 3 |Defect 1.5 |- |D1D2D3 |- |CORRECT |ANSWER✔✔-Class | 1 |Defect Class | 2 |Defect Class | 3 |Defect 1.7.1 |- |Conflict |between |J-STD |Text |and |applicable |document |cited |in |J-STD, | which |takes |precedent? |- |CORRECT |ANSWER✔✔-J-STD |text 1.7.1 |- |Conflict |between |J-STD |Text |and |assembly |drawing/documentation |not | approved |by |User, |which |takes |precedent? |- |CORRECT |ANSWER✔✔-J-STD 1.7.1 |- |Conflict |between |J-STD |Text |and |assembly |drawing/documentation | approved |by |User, |which |takes |precedent? |- |CORRECT |ANSWER✔✔-Assembly | Drawing |or |Documentation 1.8.3 |- |What |does |FOD |stand |for? |- |CORRECT |ANSWER✔✔-Foreign |Object | Debris 1.8.12 |- |Define |"User" |- |CORRECT |ANSWER✔✔-The |Individual, |Organization, | company, |or |designated |authority |responsible |for |procurement |or |design. 1.8.13 |- |Wire |Overwrap |- |CORRECT |ANSWER✔✔-Wire |wraps |around |terminal | more |than | 360 |degrees |and |remains |in |contact. 1.9 |- |If |a |condition |is |considered |a |Defect |for |Class |3, |this |means |Class | 1 |and | 2... |- |CORRECT |ANSWER✔✔-May |still |be |usable.
3.2.2 |- |If |contamination |exceeds |the |limits |... |- |CORRECT |ANSWER✔✔-intervals |between |analysis, |replacement |or |replenishment |shall |be |shortened. 3.2.2 |- |Records |containing |the |results |of |all |analyses |and |solder |bath |usage | shall |be |maintained |for... |- |CORRECT |ANSWER✔✔-A |minimum |of | 1 |year |for | each |process/system 3.3 |- |Flux |shall |conform |to |Flux |activity |levels |... |- |CORRECT |ANSWER✔✔-L0 | and |L1 |of |flux |materials |RO, |RE, |OR, |except |ORL1 |shall |not |be |used |for |no- clean |soldering. 3.3 |- |RO |Flux |- |CORRECT |ANSWER✔✔-Rosin |Flux 3.3 |- |RE |Flux |- |CORRECT |ANSWER✔✔-Resin |Flux 3.3 |- |OR |Flux |- |CORRECT |ANSWER✔✔-Organic |Flux 3.3.1 |- |When |external |flux |is |used |with |flux |cored |solder |the |fluxes |shall |be... |- | CORRECT |ANSWER✔✔-compatible |both |from |cleaning |process |standpoint |and | chemical |standpoint. 3.8.1 |- |Minor |surface |flaws, |discoloration, |meniscus |cracks, |or |chips |in | component |bodies |are... |- |CORRECT |ANSWER✔✔-Acceptable, |however |they | shall |not |expose |the |component |substrate |or |active |element |nor |affect | structural |integrity. 3.8.1 |- |Components |shall |not |be... |- |CORRECT |ANSWER✔✔-Charred |or |have | damage |in |excess |of |that |to |be |determined |to |be |a |minor |surface |flaw |that | degrades |the |component |below |the |Spec |Requirements |or |affects |Form, |Fit, | Function.
3.8.1 |- |Loss |of |metallization |as |a |result |of |processing |Shall: |(3 |points) |- | CORRECT |ANSWER✔✔--Not |expose |ceramic |on |the |terminal |end |face.
- |Be |no |greater |than |25% |of |width |or |thickness |of |any |termination |side -Be |no |more |than |50% |on |top |of |a | 5 |or | 3 |sided |termination |component 3.9 |- |A |tool |used |to |cut |leads |Shall |Not... |- |CORRECT |ANSWER✔✔-Impart |shock | that |damages |a |component |lead |seal |or |internal |connection. 4.5 |- |For |Electroless |Nickel |Immersion |Gold |(ENIG) |Nickel-palladium-gold | (NiPdAu), |or |Electro |Nickeless |Palladium |Immersion |Gold |(ENEPIG) |are |exempt | from... |- |CORRECT |ANSWER✔✔-Finish |Removal |Requirements |in |4.5.1 |and | 4.5. 4.5.1 |- |Gold |must |be |removed |from |at |least... |- |CORRECT |ANSWER✔✔-95% |of | all |the |surfaces |to |be |soldered |of |all |through-hole |components |to |be |hand | soldered. 4.5.1 |- |Gold |must |be |removed |from |at |least... |- |CORRECT |ANSWER✔✔-95% |of | all |the |surface |mounted |components |regardless |off |gold |thickness 4.5.1 |- |Gold |must |be |removed |from |at |least... |- |CORRECT |ANSWER✔✔-95% |of | all |the |surfaces |to |be |soldered |of |through-hole |components |with |>2.54 |um | gold |thickness. 4.5.1 |- |Double |tinning |process |or |dynamic |solderwave |maybe |be |used |for... |- | CORRECT |ANSWER✔✔-Gold |Removal |prior |to |mount |components. 4.5.1 |- |Gold |embrittlement |can |occur |regardless |ofgold |thickness |when... |- | CORRECT |ANSWER✔✔-Solder |volume |is |low |or |dwell |time |is |not |sufficient.
