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Published on February 16, 2017 by Matt Commens
ANSYS HFSS 18 – Raising the Bar in
Electronics
Electronics Antenna Design, EMIT
ANSYS HFSS users are consantly telling me, “Wow, I didn’t know HFSS could do that!” I guess I shouldn’t be surprised — our software development and product management teams have been working tirelessly over the las few years to integrate ever more valuable features into HFSS to deliver a product worthy of its well-deserved reputation as “the gold sandard.” Focusing on automated simulation and design workfows for antennas and high speed electronics, ANSYS HFSS 18 will help you achieve the increasing requirements for wireless connectivity, thermal performance and power efciency within shorter design schedules.
Antenna Design
Antennas are often designed in isolation under ideal
conditions. Look in any textbook on antenna design and you will see
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Related Poss
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How to Design an Antenna Array for 5G Applications Investigating Placement of Antennas Inside an Aircraft Fuselage Simulating Radar Signatures of Electrically Large Targets in ANSYS HFSS
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the equations and design procedures are developed with the antenna sructure in “free-space” or on idealized platforms. While this is appropriate for initial design sudies, antennas are actually insalled within an electronic product, mounted on a platform such as an aircraft or automobile, or placed in close proximity with other antennas. How an antenna is integrated into its environment impacts overall radio frequency (RF) sysem performance, and the simulation of the insalled antenna performance can challenge mos electromagnetic feld simulation tools on the market.
ANSYS HFSS 18 leverages new technology for simulating this insalled antenna performance with the integration of ANSYS HFSS SBR+ (shooting and bouncing ray) into the HFSS desktop. Using this powerful, efcient and accurate method, HFSS SBR+ reliably predicts performance of antennas mounted to electrically large platforms — problems previously considered too large to solve. Together with the integrated Antenna Design Toolkit, antennas synthesized, designed and optimized in HFSS can be integrated to their platform and rapidly solved with the HFSS SBR+ solver.
With a rapidly increasing number of wireless devices and a fnite spectrum in which to operate, wireless sysems are more likely to interfere with each other and degrade performance. This “RF co-site” problem involves not only the antenna coupling, but also how the associated radio is susceptible to RF interference from another radio, even when the interfering radio may be operating in a diferent frequency band. Thus, undersanding RF co-site necessarily involves both the antennas and the RF sysems to which they are attached. The ANSYS 18 RF option now includes EMIT, a simulation tool for predicting RF co-site and EMI mitigation of multiple radio transmitters and receivers.
Broadband Adaptive Meshing
Ask six wireless experts “what is 5G?” and you might get ten diferent answers. All agree that 5G will provide much greater data rate to users, 1,000 times more bandwidth compared to 4G, the possibility to connect to billions of the Internet of Things (IoT) devices and a large reduction in energy use.
While the 5G sandard is sill in development, some requirements are known and should be considered when selecting simulation and design tools. In particular, in order for the mobile user to enjoy 10Gb/s
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reliable electronics products to market.
Multiphysics: Thermal Efciency and
Mechanical Reliability
ANSYS provides a complete multiphysics fow to address electrical, thermal, and sructural reliability in high-frequency sysems. With smaller, lower power, more portable devices, the design of isolated components is no longer valid. You can’t work from a schematic absract of a RF and microwave sysem; you mus consider the physical description of the sysem so that all physical efects can be included. This means visualizing the entire physical design, inserting appropriate components such as surface mount devices, connectors, MMICs/RFICs, and running linear, nonlinear, and transient simulation with all electromagnetic efects included. Then you mus perform comprehensive analyses including thermal, sress, shock, and vibration efects to capture all multiphysics efects.
To that end, we have developed a new integrated RF design fow to support high-frequency design from layout, inclusion of signal integrity, power integrity, EMI, 3-D device integration and thermal and sructural reliability; especially important for mission critical electronics found in transportation.
I could go on about the innovations available within ANSYS HFSS 18, but the editors have cut me of! However, you can learn more from the HFSS hightlight page.
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