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Datasheet

HUAWEI EM770W HSPA PC EMBEDDED

MODULE

V100R

Issue 03

Date (^) 2009-08-

HUAWEI TECHNOLOGIES CO., LTD.^ HUAWEI Confidential

Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. Please feel free to contact our local office or company headquarters.

Huawei Technologies Co., Ltd.

Address: Huawei Industrial Base

Bantian, Longgang Shenzhen 518129 People's Republic of China

Website: http://www.huawei.com

Email: [email protected]

Copyright © Huawei Technologies Co., Ltd. 2008. All rights reserved.

No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions

and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.

All other trademarks and trade names mentioned in this document are the property of their respective holders.

Notice

The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute the warranty of any kind, express or implied.

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Datasheet

History

Issue Details Date Author Approved By

01 Creation 2008-09-15 Tan Xiao'an Xie Conglong

02 Modified 2009-06-20 Fred Luo Xie Bingfeng

03 Modified 2009-08-31 Fred Luo Xie Bingfeng

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Datasheet

• 1 Overview Contents
  • 1.1 Introduction
  • 1.2 Key Features...............................................................................................................................
  • 1.3 Hardware Overview...................................................................................................................
    • 1.3.1 Hardware Logic Block Diagram
    • 1.3.2 External Hardware Interfaces .............................................................................................
  • 1.4 Software Overview
• 2 Mechanical Specifications...........................................................................................
  • 2.1 Dimensions and interfaces.........................................................................................................
    • 2.1.1 Dimensions and interfaces of the EM770W
    • 2.1.2 Dimensions of the Mini PCI Express Connector.................................................................
    • 2.1.3 Dimensions of the Antenna Connector...............................................................................
  • 2.2 Reliability...................................................................................................................................
  • 2.3 Temperature
• 3 Electrical Specifications
  • 3.1 Mini PCI Express Pin Definition
  • 3.2 Pin Descriptions
    • 3.2.1 Digital Signal DC Characteristics.......................................................................................
    • 3.2.2 Power Sources and Grounds
    • 3.2.3 USB Signals......................................................................................................................
    • 3.2.4 USIM Signals....................................................................................................................
    • 3.2.5 PCM Interface Signals
    • 3.2.6 W_DISABLE# Signal.........................................................................................................
    • 3.2.7 LED_WWAN# Signal.........................................................................................................
    • 3.2.8 PERST# Signal.................................................................................................................
    • 3.2.9 NC Pins
  • 3.3 Power Supply and Consumption................................................................................................
    • 3.3.1 Power Supply....................................................................................................................
    • 3.3.2 Power Consumption..........................................................................................................
    • 3.3.3 Module Power Saving Mode Design Guide for Windows XP
• 4 RF Specifications
  • 4.1 Operating Frequencies
  • 4.2 Conducted RF Measurement..................................................................................................... Datasheet
    • 4.2.1 Test Environment
    • 4.2.2 Test Standards
  • 4.3 Conducted Rx Sensitivity and Tx Power.....................................................................................
    • 4.3.1 Conducted Receive Sensitivity
    • 4.3.2 Conducted Transmit Power
  • 4.4 Antenna Design Requirements
    • 4.4.1 Antenna Design Indicators
    • 4.4.2 Interference
    • 4.4.3 Radio Test Environment
    • 4.4.4 Design Recommendations
  • 4.5 Offline Mode..............................................................................................................................
• 5 Software and Tools
  • 5.1 Firmware
    • 5.1.1 Version Descriptions
  • 5.2 Drivers
    • 5.2.1 Windows Drivers...............................................................................................................
    • 5.2.2 Linux Drivers.....................................................................................................................
  • 5.3 Dashboard
    • 5.3.1 Windows Dashboard
    • 5.3.2 Linux Dashboard...............................................................................................................
  • 5.4 GPS
    • 5.4.1 Introduction.......................................................................................................................
    • 5.4.2 Functionality......................................................................................................................
    • 5.4.3 Performance
    • 5.4.4 GPS Applet
  • 5.5 Tools
    • 5.5.1 Firmware Update Tool
    • 5.5.2 Module Label Print Tool–MLT
    • 5.5.3 Engineering Tools
    • 5.5.4 Debugging Board
• 6 Test and Certification...................................................................................................
  • 6.1 Reliability Test for Module..........................................................................................................
    • 6.1.1 Environmental Reliability Test............................................................................................
    • 6.1.2 Mechanical Reliability Test
    • 6.1.3 Temperature-Relevant Tests..............................................................................................
  • 6.2 Temperature Rise Test...............................................................................................................
    • 6.2.1 Temperature Rise Test Result............................................................................................
  • 6.3 TRP and TIS..............................................................................................................................
    • 6.3.1 Total Radiated Power
    • 6.3.2 Total Isotropic Sensitivity
    • 6.3.3 Intermediate Channel Relative Sensitivity........................................................................ Datasheet
  • 6.4 Product Certifications
  • 6.5 Environmental Protection Certification and Test
    • 6.5.1 RoHS..............................................................................................................................
    • 6.5.2 WEEE.............................................................................................................................
    • 6.5.3 PVC-free.........................................................................................................................
  • 6.6 National Compulsory Certification............................................................................................
    • 6.6.1 Product Certification........................................................................................................
    • 6.6.2 Importance of Product Certification..................................................................................
    • 6.6.3 Product Certification Test Items
    • 6.6.4 Product Certification Classifications.................................................................................
    • 6.6.5 Certification Modes
    • 6.6.6 Certification Types...........................................................................................................
    • 6.6.7 Guide to Product Certification...........................................................................................
    • 6.6.8 Nameplate .......................................................................................................................
  • 6.7 GCF and PTCRB......................................................................................................................
    • 6.7.1 GCF Certification .............................................................................................................
    • 6.7.2 PTCRB Certification.........................................................................................................
    • 6.7.3 Overall-System Certification .............................................................................................
• 7 Technical Reference...................................................................................................
  • 7.1 Layer 1 Specifications (Physical)
  • 7.2 Layer 2 Specifications (MAC/RLC)...........................................................................................
  • 7.3 Layer 3 Specifications (RRC)...................................................................................................
  • 7.4 Layer 3 NAS/Core Network (MM/CM)
  • 7.5 GSM Protocol Specifications....................................................................................................
  • 7.6 GPRS Protocol Specifications..................................................................................................
  • 7.7 General Specifications.............................................................................................................
  • 7.8 Performance/Test Specifications
  • 7.9 SIM Specifications

Datasheet

1 Overview

1.1 Introduction

HUAWEI EM770W HSPA PC Embedded Module (hereinafter referred to as the EM770W) is a HSPA Wireless Wide Area Network (WWAN) PC module. It is a multi- mode wireless terminal for business professionals.

The EM770W supports the following standards: l (^) High Speed Packet Access(HSPA) l (^) Universal Mobile Telecommunications System (UMTS) l (^) Enhanced Data Rates for Global Evolution (EDGE) l (^) General Packet Radio Service (GPRS) l (^) Global System for Mobile Communications (GSM)

The EM770W provides the following services:

l (^) HSPA/UMTS packet data service l (^) EDGE/GPRS packet data service l (^) WCDMA/GSM short message service (SMS)

The EM770W can be connected to a PC via the Mini PCI Express interface. In the service area of the HSPA, UMTS, EDGE, GPRS or GSM network, you can surf the Internet, send messages and emails, and receive messages/emails cordlessly. The EM770W is fast, reliable, and easy to operate. Thus, mobile users can experience many new features and services with the EM770W. These features and services will enable a large number of users to use the EM770W and the average revenue per user (ARPU) of operators will increase substantially.

Figure 1-1 shows the profile of the EM770W.

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Datasheet

Feature EM770W

EDGE packet data service of up to 236.8 kbps Y

GPRS packet data service of up to 85.6 kbps Y

CS domain data service based on UMTS and GSM Y

SMS based on the CS/PS domain of GSM and WCDMA Y

Unstructured Supplementary Service Data (USSD) Y

GPS(GPS Standalone) Y

AGPS(Assisted GPS) O

PCM interface O

Mini PCI Express 1.2 interface Y

Windows 2000/Windows XP/Windows Vista/Windows 7/Linux 2.6. or later versions

Y

Notes : Y: The feature is supported. O: The feature is optional. N: The feature is NOT supported.

1.3 Hardware Overview

The hardware of the EM770W consists of three sections: baseband section, power management (PM) section, and radio frequency (RF) section. External interfaces include the antenna interface and the Mini PCI Express interface.

1.3.1 Hardware Logic Block Diagram

The EM770W is completed on a single-board. Figure 1-2 shows the hardware functional block diagram.

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Datasheet

Figure 1-2 Hardware functional block diagram

The circuitry of the EM770W consists of three sections: baseband section, RF section, and PM section.

l (^) The baseband section includes the baseband processor and SDRAM/flash MCP. It implements baseband signals processing, wireless protocols, and management of various peripheral devices. l (^) The RF section includes the RF transceiver, PA, antenna switches, duplexer, and antenna interfaces, and it supports receive diversity. l (^) The PMU section includes PM IC and DC-DC circuits, providing the power supply and power management for the whole module.

1.3.2 External Hardware Interfaces

1. Antenna interface

The EM770W has a main antenna connector and an auxiliary antenna connector.

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Datasheet

− Power sources and grounds: The PCI Express Mini Card provides two power sources, including the one at 3.3 Vaux (3.3Vaux) and the one at 1.5 V(+1.5 V). The EM770W uses the 3.3 voltage as the power supply.

1.4 Software Overview

Figure 1-4 Software logic block diagram

Descriptions of the functional modules in the system architecture are as follows.

Firmware Drivers

The firmware drivers include drivers of the RF module, flash, and all the peripherals such as the SIM card and USB device.

Platform Service Subsystem

The platform service subsystem initializes programs, diagnoses, downloads data, and serves as a watchdog.

Dashboard

PC Drivers

Application Service

Subsystem

Firmware Drivers

Platform Service Subsystem

PC

Firmware

Mini PCIE interface

Firmware

PC Drivers

Dashboard

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Application Service Subsystem

The application service subsystem consists of various application services and a WCDMA-GSM dual mode protocol stack. Application services handle the commands and data sent from PC side according to service categories, and deliver them to the protocol stack. The protocol stack communicates with the network side to process the commands and data, and returns response from network to application services. Finally, application services return responses to PC side.

The main application services are as follows:

l (^) Call management service l (^) SMS service l (^) CS/PS data service

PC Drivers

The PC drivers are used to implement functions such as the interaction between the dashboard and the firmware.

Dashboard

The dashboard enables the PC side to display the interfaces of initiating or answering a call, and sending and receiving messages. It provides the interface for CS/PS domain network accessing and periodically refreshes the interface of the current USB modem status. The interface is provided to the end users.

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Figure 2-2 Appearance of the interfaces on the EM770W

Mini PCI Express connector

It is used to connect the EM770W to the WWAN Mini PCI Express interface of the PC.

Screw holes

They are used to fix the EM770W on the main board of the PC with screws.

Antenna interfaces

They are used to connect to antennas. Auxiliary antenna and main antenna are combined to support receive diversity. The receive diversity can strengthen the received RF signal quality and improve RF performance, and whether to open or close the receive diversity function can be controlled by software.

Notes :

It is strongly recommended adding auxiliary antenna when designing PC with the EM770W.

2.1.2 Dimensions of the Mini PCI Express Connector

The EM770W adopts a standard Mini PCI Express connector that has 52 pins and complies with the PCI Express Mini Card Electromechanical Specification Revision

1..

Figure 2-3 shows a 52-pin Mini PCI Express connector (take the Molex 67910002 as an example).

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Figure 2-3 Dimensions of the Mini PCI Express connector

2.1.3 Dimensions of the Antenna Connector

The EM770W provides an interface for connecting an external antenna. The external antenna is connected to the module through the coaxial connector that is the Hirose U.FL-R-SMT-1(10) (you can get to know Hirose U.FL-R-SMT-1(10) by visiting the website http://www.hirose-connectors.com/products/U.FL_1.htm).

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Datasheet

2.2 Reliability

Table 2-1 Requirements on the environment reliability

Test Case Standard

High temperature IEC60068-2-

High temperature IEC60068-2-

Random vibration

MIL-STD-810F-

METHOD 514.

Shock vibration ANSI/TIA-603-C-2004 -3.3.

Operational

Sine sweep vibration ANSI/TIA-603-C-2004 -3.3.

High temperature IEC60068-2-

Low temperature IEC60068-2-

Damp heat, cyclic IEC60068-2-

Thermal shock IEC60068-2-

Salt-fog IEC60068-2-

Drop IEC 60068-2-

Environment reliability

Non- operational

Durability EIA-364-

2.3 Temperature

Table 2-2 Operating and storage temperature

Description Minimum Maximum Unit

Operating temperature – 10 +55 °C

Operating temperature (reduced RF performance)

– 20 +65 °C

Storage temperature – 40 +85 °C

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Datasheet

3 Electrical Specifications

3.1 Mini PCI Express Pin Definition

The physical connections and signal levels of the EM770W comply with PCI Express Mini CEM specifications. Device operations comply with USB 2.0 specifications.

Table 3-1 lists the Mini PCI Express connector pins out of the EM770W.

Table 3-1 Definition of mini PCI Express pins

Definition of the EM770W Mini PCI Express pins

Pin No.

Mini PCI Express Standard Description

HUAWEI Pin Description

Additional Description

Direction to Module

1 WAKE# NC Not connected. -

2 3.3Vaux VCC_3V3 3.3 V DC supply rails from the PC side.

Input

3 COEX1 NC Not connected. -

4 GND GND Mini Card ground. -

5 COEX2 NC Not connected. -

6 1.5 V NC Not connected. -

7 CLKREQ# NC Not connected. -

8 UIM_PWR UIM_PWR Power source for the external UIM/SIM card.

Output

9 GND GND Mini Card ground. -

10 UIM_DATA UIM_DATA External UIM/SIM data signal.

Input/Output

11 REFCLK- NC Not connected. -

12 UIM_CLK UIM_CLK External UIM/SIM clock signal.

Output

13 REFCLK+ NC Not connected. -

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