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Digi International Inc.
11001 Bren Road East
Minnetonka, MN 55343
877 912-3444 or 952 912-
http://www.digi.com
XBee®/XBee-PRO® ZB RF Modules
ZigBee RF Modules by Digi International Models: XBEE2, XBEEPRO2, PRO S2B Hardware: S2 and S2B Firmware Versions:
- 20xx - Coordinator - AT/Transparent Operation
- 21xx - Coordinator - API Operation
- 22xx - Router - AT/Transparent Operation
- 23xx - Router - API Operation
- 28xx - End Device - AT/Transparent Operation
- 29xx - End Device - API Operation
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© 2010 Digi International, Inc. All rights reserved
No part of the contents of this manual may be transmitted or reproduced in any
form or by any means without the written permission of Digi International, Inc.
ZigBee® is a registered trademark of the ZigBee Alliance.
XBee® and XBee‐PRO® are registered trademarks of Digi International, Inc.
Technical Support: Phone: (866) 765-9885 toll-free U.S.A. & Canada (801) 765-9885 Worldwide 8:00 am - 5:00 pm [U.S. Mountain Time] Live Chat: www.digi.com Online Support: http://www.digi.com/support/eservice/login.jsp Email: [email protected]
Design Considerations for Digi Drop-In Networking
- © 2010 Digi Internaitonal, Inc.
- Overview - What's New in 2x7x - Firmware - Manual - Key Features - Worldwide Acceptance - Specifications - Hardware Specs for Programmable Variant - Mechanical Drawings - SIF Header Interface - Mounting Considerations - Pin Signals - EM250 Pin Mappings - Design Notes - Power Supply Design - Recommended Pin Connections - Board Layout - Electrical Characteristics - Module Operation for Programmable Variant - XBEE Programmable Bootloader - Overview - Bootloader Software Specifics - Bootloader Menu Commands - Firmware Updates - Output File configuration
- RF Module Operation - Serial Communications - UART Data Flow - Serial Buffers - Serial Flow Control - Serial Interface Protocols - Modes of Operation - Idle Mode - Transmit Mode - Receive Mode - Command Mode - Sleep Mode
- XBee ZigBee Networks - Introduction to ZigBee - ZigBee Stack Layers - Networking Concepts - Device Types - PAN ID - Operating Channel - ZigBee Application Layers: In Depth - Application Support Sublayer (APS) - Application Profiles - Coordinator Operation - Forming a Network - Channel Selection - PAN ID Selection - Security Policy - Persistent Data - XBee ZB Coordinator Startup - Permit Joining - Resetting the Coordinator - Leaving a Network - Replacing a Coordinator (Security Disabled Only) - Example: Starting a Coordinator - Example: Replacing a Coordinator (security disabled) - Router Operation - Discovering ZigBee Networks - Joining a Network - Authentication - Persistent Data - XBee ZB Router Joining - Permit Joining - Joining Always Enabled - Joining Temporarily Enabled - Router Network Connectivity - Leaving a Network - Resetting the Router - Example: Joining a Network - End Device Operation - Discovering ZigBee Networks - Joining a Network - Parent Child Relationship - End Device Capacity - Authentication - Persistent Data - Orphan Scans - XBee: ZB End Device Joining - Parent Connectivity - Resetting the End Device - Leaving a Network - Example: Joining a Network - Channel Scanning
- © 2010 Digi Internaitonal, Inc. Contents - Managing Multiple ZigBee Networks - PAN ID Filtering - Preconfigured Security Keys - Permit Joining - Application Messaging
- Transmission, Addressing, and Routing
- Addressing
- 64-bit Device Addresses
- 16-bit Device Addresses
- Application Layer Addressing
- Data Transmission
- Broadcast Transmissions
- Unicast Transmissions
- Data Transmission Examples
- RF Packet Routing
- Link Status Transmission
- AODV Mesh Routing
- Many-to-One Routing
- Source Routing
- Encrypted Transmissions
- Maximum RF Payload Size
- Throughput
- ZDO Transmissions
- ZigBee Device Objects (ZDO)
- Sending a ZDO Command
- Receiving ZDO Commands and Responses
- Transmission Timeouts
- Unicast Timeout
- Extended Timeout
- Transmission Examples
- Security
- Security Modes
- ZigBee Security Model
- Network Layer Security
- Frame Counter
- Message Integrity Code
- Network Layer Encryption and Decryption
- Network Key Updates
- APS Layer Security
- Message integrity Code
- APS Link Keys
- APS Layer Encryption and Decryption
- Network and APS Layer Encryption - Trust Center - Forming and Joining a Secure Network - Implementing Security on the XBee - Enabling Security - Setting the Network Security Key - Setting the APS Trust Center Link Key - Enabling APS Encryption - Using a Trust Center - XBee Security Examples - figured link keys) Example 1: Forming a network with security (pre-con- - ing keys during joining) Example 2: Forming a network with security (obtain-
- Network Commissioning and Diagnostics
- Device Configuration
- Device Placement
- Link Testing
- RSSI Indicators
- Device Discovery
- Network Discovery
- ZDO Discovery
- Joining Announce
- Commissioning Pushbutton and Associate LED
- Commissioning Pushbutton
- Associate LED
- Managing End Devices
- End Device Operation
- Parent Operation
- End Device Poll Timeouts
- Packet Buffer Usage
- Non-Parent Device Operation
- XBee End Device Configuration
- Pin Sleep
- Cyclic Sleep
- Transmitting RF Data
- Receiving RF Data
- IO Sampling
- ton Waking End Devices with the Commissioning Pushbut-
- Parent Verification
- Rejoining
- XBee Router/Coordinator Configuration
- RF Packet Buffering Timeout
- Child Poll Timeout
- © 2010 Digi Internaitonal, Inc. Contents - Transmission Timeout - Putting it all Together - Short Sleep Periods - Extended Sleep Periods - Sleep Examples
- XBee Analog and Digital IO Lines - IO Configuration - IO Sampling - Queried Sampling - Periodic IO Sampling - Change Detection Sampling - RSSI PWM - IO Examples
- API Operation
- API Frame Specifications
- API UART Exchanges
- AT Commands
- Transmitting and Receiving RF Data
- Remote AT Commands
- Source Routing
- Supporting the API
- API Frames
- AT Command
- AT Command - Queue Parameter Value
- ZigBee Transmit Request
- Explicit Addressing ZigBee Command Frame
- Remote AT Command Request
- Create Source Route
- AT Command Response
- Modem Status
- ZigBee Transmit Status
- ZigBee Receive Packet
- ZigBee Explicit Rx Indicator
- ZigBee IO Data Sample Rx Indicator
- XBee Sensor Read Indicator
- Node Identification Indicator
- Remote Command Response
- Over-the-Air Firmware Update Status
- Route Record Indicator
- Many-to-One Route Request Indicator
- with the API Sending ZigBee Device Objects (ZDO) Commands - with the API Sending ZigBee Cluster Library (ZCL) Commands - Sending Public Profile Commands with the API - XBee Command Reference Tables - Module Support - X-CTU Configuration Tool - Customizing XBee ZB Firmware - XBee Bootloader - Programming XBee Modules - Serial Firmware Updates - Invoke XBee Bootloader - Send Firmware Image - SIF Firmware Updates - Writing Custom Firmware - Regulatory Compliance - Enabling GPIO 1 and - Detecting XBee vs. XBee-PRO - Ensuring Optimal Output Power - Improving Low Power Current Consumption - XBee (non-PRO) Initialization: - When sleeping (end devices): - When waking from sleep (end devices): - Appendix A:Definitions - Appendix B: Agency Certifications - Appendix C:Migrating from ZNet 2.5 to XBee ZB - Appendix D:Additional Information
Manual
The XBee/XBee-PRO/S2B ZB 2x7x manual includes the following corrections over the 2x6x manual: •Descriptions and specification for the PRO S2B. •SIF Header Interface, pin 8 relabeled as pin 10. •Pin mappings for pins 22 and 24 updated. •New modem status codes were added. •Corrections to the ZigBee Receive Packet description. •Description changes for the SC, PL, PP, AO, IR, %V, and PO commands. •Updates to Appendix B.
Key Features
Worldwide Acceptance
FCC Approval (USA) Refer to Appendix A for FCC Requirements. Systems that contain XBee®/ XBee-PRO® ZB RF Modules inherit Digi Certifications. ISM (Industrial, Scientific & Medical) 2.4 GHz frequency band Manufactured under ISO 9001:2000 registered standards XBee®/XBee-PRO® ZB RF Modules are optimized for use in US, Canada, Europe, Australia, and Japan (contact Digi for complete list of agency approvals).
High Performance, Low Cost XBee
- Indoor/Urban: up to 133’ (40 m)
- Outdoor line-of-sight: up to 400’ (120 m)
- Transmit Power: 2 mW (3 dBm)
- Receiver Sensitivity: -96 dBm XBee-PRO (S2)
- Indoor/Urban: up to 300’ (90 m), 200' ( m) for International variant
- Outdoor line-of-sight: up to 2 miles ( m), 5000' (1500 m) for International variant
- Transmit Power: 50mW (17dBm), 10mW (10dBm) for International variant
- Receiver Sensitivity: -102 dBm XBee-PRO (S2B)
- Indoor/Urban: up to 300’ (90 m), 200' ( m) for International variant
- Outdoor line-of-sight: up to 2 miles ( m), 5000' (1500 m) for International variant
- Transmit Power: 63mW (18dBm), 10mW (10dBm) for International variant
- Receiver Sensitivity: -102 dBm Advanced Networking & Security Retries and Acknowledgements DSSS (Direct Sequence Spread Spectrum) Each direct sequence channel has over 65,000 unique network addresses available Point-to-point, point-to-multipoint and peer-to-peer topologies supported Self-routing, self-healing and fault-tolerant mesh networking
Low Power XBee
- TX Peak Current: 40 mA (@3.3 V)
- RX Current: 40 mA (@3.3 V)
- Power-down Current: < 1 A XBee-PRO (S2)
- TX Peak Current: 295mA (170mA for international variant)
- RX Current: 45 mA (@3.3 V)
- Power-down Current: 3.5 A typical @ 25 degrees C XBee-PRO (S2B)
- TX Peak Current: 205mA (117mA for international variant)
- RX Current: 47 mA (@3.3 V)
- Power-down Current: 3.5 A typical @ 25 degrees C Easy-to-Use No configuration necessary for out-of box RF communications AT and API Command Modes for configuring module parameters Small form factor Extensive command set Free X-CTU Software (Testing and configuration software) Free & Unlimited Technical Support
Hardware Specs for Programmable Variant
The following specifications need to be added to the current measurement of the previous table if the module has the programmable secondary processor. For example, if the secondary processor is running and constantly collecting DIO samples at a rate while having the RF portion of the XBEE sleeping the new current will be I total = I (^) r2 + Is. Where Ir2 is the runtime current of the secondary processor and I (^) s is the sleep current of the RF portion of the module of the XBEE-PRO (S2B) listed in the table below.
Mechanical Drawings
Mechanical drawings of the XBee®/XBee‐PRO® ZB RF Modules (antenna options not shown) .
Australia C-Tick C-Tick C-Tick
Japan R201WW07215215 R201WW08215142 (internationalvariant) R201WW10215062 (international variant)
RoHS Compliant Compliant Compliant
Specifications of the programmable secondary processor
Optional Secondary Processor Specification
These numbers add to S2B specifications (Add to RX, TX, and sleep currents depending on mode of operation) Runtime current for 32k running at 20MHz +14mA Runtime current for 32k running at 1MHz +1mA Sleep current +0.5uA typical For additional specifications see Freescale Datasheet and Manual MC9SO8QE Minimum Reset low pulse time for EM250 +50 nS (additional resistor increases minimum time) VREF Range 1.8VDC to VCC
Specifications of the XBee®/XBee‐PRO® ZB RF Module Specification XBee XBee-PRO (S2) XBee-PRO (S2B)
Mechanical Drawings for the RPSMA Variant
SIF Header Interface
The XBee/XBee-PRO ZB modules include a SIF programming header that can be used with Ember's programming tools to upload custom firmware images onto the XBee module. The SIF header orientation and pinout are shown below.
A male header can be populated on the XBee that mates with Ember's 2x5 ribbon cable. The male header and ribbon cables are available from Samtec: 2x5 Male Header - FTSH-105-01-F-DV-K 2x5 Ribbon Cable - FFSD-05-D-12.00-01-N
Pin Signals
- Signal Direction is specified with respect to the module
- See Design Notes section below for details on pin connections.
Pin Assignments for the XBee‐PRO Modules (Low‐asserted signals are distinguished with a horizontal line above signal name.) Pin # Name Direction Default State Description 1 VCC - - Power supply 2 DOUT Output Output UART Data Out 3 DIN / CONFIG Input Input UART Data In 4 DIO12 Both Disabled Digital I/O 12 5 RESET Both Open-Collector withpull-up Module Reset (reset pulse must be at least 200ns) 6 RSSI PWM / DIO10 Both Output RX Signal Strength Indicator / Digital IO 7 DIO11 Both Input Digital I/O 11 8 [reserved] - Disabled Do not connect 9 DTR / SLEEP_RQ/ DIO8 Both Input Pin Sleep Control Line or Digital IO 8 10 GND - - Ground 11 DIO4 Both Disabled Digital I/O 4 12 CTS / DIO7 Both Output Clear-to-Send Flow Control or Digital I/O 7. CTS, ifenabled, is an output. 13 ON / SLEEP Output Output Module Status Indicator or Digital I/O 9
14 VREF Input -
Not used for EM250. Used for programmable secondary processor. For compatibility with other XBEE modules, we recommend connecting this pin voltage reference if Analog sampling is desired. Otherwise, connect to GND. 15 Associate / DIO5 Both Output Associated Indicator, Digital I/O 5 16 RTS / DIO6 Both Input Request-to-Send Flow Control, Digital I/O 6. RTS,if enabled, is an input. 17 AD3 / DIO3 Both Disabled Analog Input 3 or Digital I/O 3 18 AD2 / DIO2 Both Disabled Analog Input 2 or Digital I/O 2 19 AD1 / DIO1 Both Disabled Analog Input 1 or Digital I/O 1 (^20) Commissioning ButtonAD0 / DIO0 / Both Disabled Analog Input 0, Digital IO 0, or CommissioningButton
EM250 Pin Mappings
The following table shows how the EM250 pins are used on the XBee.
- NOTE: These lines may not go to the external XBEE pins of the module if the programmable secondary processor is populated.
Design Notes
The XBee modules do not specifically require any external circuitry or specific connections for proper operation. However, there are some general design guidelines that are recommended for help in troubleshooting and building a robust design.
Power Supply Design
Poor power supply can lead to poor radio performance especially if the supply voltage is not kept within tolerance or is excessively noisy. To help reduce noise a 1uF and 8.2pF capacitor are recommended to be placed as near to pin1 on the PCB as possible. If using a switching regulator for your power supply, switching frequencies above 500kHz are preferred. Power supply ripple should be limited to a maximum 250mV peak to peak. Note – For designs using the programmable modules an additional 10uF decoupling cap is recommended near pin 1 of the module. The nearest proximity to pin 1 of the 3 caps should be in the following order: 8.2pf, 1uF followed by 10uF.
EM250 Pin Number XBee Pin Number Other Usage 13 (Reset) 5* Connected to pin 8 on 2x5 SIF header. 19 (GPIO 11) 16* 20 (GPIO 12) 12* 21 (GPIO 0) (^15)
22 (GPIO 1)
XBee Tied to ground (module identification) XBee-PRO (S2) Low-asserting shutdown line for output power compensation circuitry. XBee-PRO (S2B) Used to communicate with Temp Sensor and control Shutdown for low power mode.
24 (GPIO 2)
XBee Not connected. Configured as output low. XBee-PRO (S2) Powers the output power compensation circuitry. XBee-PRO (S2B) Used to communicate with Temp Sensor and control Shutdown for low power mode. 25 (GPIO 3) 13 26 (GPIO 4 / ADC 0) 20 Connected to pin 9 on 2x5 SIF header. 27 (GPIO 5 / ADC 1) 19 Connected to pin 10 on 2x5 SIF header. 29 (GPIO 6 /ADC 2) 18 30 (GPIO 7 / ADC 3 17 31 (GPIO 8) 4 32 (GPIO 9) 2* 33 (GPIO 10) 3* 34 (SIF_CLK) Connected to pin 6 on 2x5 SIF header. 35 (SIF_MISO) Connected to pin 2 on 2x5 SIF header. 36 (SIF_MOSI) Connected to pin 4 on 2x5 SIF header. 37 (SIF_LOAD) Connected to pin 7 on 2x5 SIF header. 40 (GPIO 16) 7 41 (GPIO 15) 6 42 (GPIO 14) 9 43 (GPIO 13) 11
Electrical Characteristics
Note – The signal-ended ADC measurements are limited in their range and only guaranteed for accuracy in the range 0 to VREFI. The nature of the ADC’s internal design allows for measurements outside of this range (+/- 200mV), but the accuracy of such measurements are not guaranteed.
Module Operation for Programmable Variant
The S2B modules that have the programmable option populated have a secondary processor with 32k of flash and 2k of RAM. This allows module integrators to put custom code on the XBEE module to fit their own unique needs. The DIN, DOUT, RTS, CTS, and RESET lines are intercepted by the secondary processor to allow it to be in control of the data transmitted and received. All other lines are in parallel and can be controlled by either the EM250 or the MC9SO8QE micro (see Block Diagram for details). The EM250 by default has control of certain lines. These lines can be released by the EM250 by sending the proper command(s) to disable the desired DIO line(s) (see XBEE Command Reference Tables). In order for the secondary processor to sample with ADCs, the XBEE pin 14 (VREF) needs to be connected to a reference voltage. Digi provides a bootloader that can take care of programming the processor over the air or through the serial interface. This means that over the air updates can be supported through an XMODEM protocol. The processor can also be programmed and debugged through a one wire interface BKGD (Pin 8).
DC Characteristics of the XBee/XBee‐PRO Symbol Parameter Condition Min Typical Max Units V (^) IL Input Low Voltage All Digital Inputs - - 0.2 * VCC V V (^) IH Input High Voltage All Digital Inputs 0.8 * VCC - - V VOL Output Low Voltage VCC >= 2.7 V - - 0.18VCC V V (^) OH Output High Voltage VCC >= 2.7 V 0.82VCC - - V I (^) IIN Input Leakage Current V (^) IN = VCC or GND, all inputs, per pin (^) - - 0.5uA uA I (^) OHS Output source current (standard) (^) RSSI/PWM, DIO10, DIO4All digital outputs except 4 mA
IOHH Output source current (highcurrent) RSSI/PWM, DIO10, DIO4 digital outputs 8 mA
IOLS Output sink current (standard (^) RSSI/PWM, DIO10, DIO4All digital inputs except 4 mA I (^) OLH Output sink current (high current) RSSI/PWM, DIO10, DIO4 digital outputs 8 mA I (^) OH + I (^) OL Total output current for all I/O pins All digital outputs 40 mA V (^) REFI VREF Internal EM250 has an internal reference that isfixed 1.19 1.2 1.21 V V (^) IADC ADC input voltage range 0 VREFI V RIS Input impedance When taking a sample 1 M Ohm R (^) I Input Impedance When not taking a sample 10 M Ohm
XBEE Programmable Bootloader
Overview
The Xbee Programmable module is equipped with a Freescale MC9S08QExx application processor. This application processor comes with a supplied bootloader. The following section describes how to interface the customer's application code running on this processor to the XBee Programmable module's supplied bootloader. This section discusses how to initiate firmware updates using the supplied bootloader for wired and over-the- air updates.
Bootloader Software Specifics
Memory Layout
Figure 1 shows the memory map for the MC9S08QE32 application processor. The supplied bootloader occupies the bottom pages of the flash from 0xF200 to 0xFFFF. Application code cannot write to this space. The application code can exist in Flash from address 0x8400 to 0xF1BC. 1k of Flash from 0x8000 to 0x83FF is reserved for Non Volatile Application Data that will not be erased by the bootloader during a flash update. A portion of RAM is accessible by both the application and the bootloader. Specifically, there is a shared data region used by both the application and the bootloader that is located at RAM address 0x200 to 0x215. Application code should not write anything to AppResetCause or BLResetCause unless informing the bootloader of the impending reset reason.
