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Cryo-electron microscopy (cryo-EM) is a revolutionary technique for visualizing DNA structures using Creative Biostructure's platform. This technology overcomes size and throughput limitations, enabling the creation of soluble nanostructures with high spatial resolution and chemical versatility. It allows for the observation of biomolecules in their natural aqueous environment, preserving their spatial arrangement. With the ability to image hundreds of thousands of single molecules, cryo-EM has transformed structural biology, allowing for the study of various targets and gaining new mechanistic insights for drug design. Creative Biostructure's research team has successfully obtained the 3D classification model of DNA samples using cryo-EM image analysis.
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Cryo-electron microscopy (cryo-EM) can be used to visualize DNA or
RNA structures based on our cryo-EM platform provided by Creative
Biostructure. We develop a novel suite of tools to overcome the size
and throughput limitations of cryo-EM, which can be applied to small
molecules such as DNA or RNA. It allows us to create soluble
nanostructures with an unprecedented combination of spatial
resolution and chemical versatility. In principle, we can attach any
moiety to our devices as long as it has a DNA binding domain or it can
be coupled to DNA.
Our research team has experience in exploiting cryo-EM image analysis
to obtain structural information to reveal the configuration of a
designed DNA nanostructure (Figure 1). We successfully obtained the
3D classification model of the DNA samples offered by our customer. All
the 2D TEM particles were classified by the 3D similarity and
consistence by using 3D classification function. For practical
applications, it is essential to verify that the 3D structures are
accurately produced as designed, which requires high resolution, at
least sufficient to resolve the DNA helix.
Reference
Takayuki Kato, Russell P. Goodman et al. (2009) High-Resolution
Structural Analysis of a DNA Nanostructure by cryoEM_. Nano Lett._ 2009,
9 (7), pp 2747–2750.