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Um10492 datasheet electronica, Apuntes de Electrotecnia

Um10492 electronica datasheet . Programacion

Tipo: Apuntes

2025/2026

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UM10492
PTN3460 eDP to LVDS bridge IC application board
Rev. 1.1 — 16 March 2015 User manual
Document information
Info Content
Keywords PTN3460, DisplayPort, eDP, LVDS, bridge, application board
Abstract This user manual presents demonstration/application board capability of
interfacing an (embedded) DisplayPort source to an LVDS panel. The
application board (nicknamed ‘DPLVDS1’) is intended for use as an
evaluation and customer demonstration tool, as well as a reference
design.
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PTN3460 eDP to LVDS bridge IC application board

Rev. 1.1 — 16 March 2015 User manual

Document information Info Content Keywords PTN3460, DisplayPort, eDP, LVDS, bridge, application board Abstract This user manual presents demonstration/application board capability of interfacing an (embedded) DisplayPort source to an LVDS panel. The application board (nicknamed ‘DPLVDS1’) is intended for use as an evaluation and customer demonstration tool, as well as a reference design.

UM10492 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.

Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]

PTN3460 eDP to LVDS bridge IC application board

Revision history Rev Date Description 1.1 20150316 Table 3; Removed remark for JP 1 20140903 User manual; initial release

UM10492 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.

PTN3460 eDP to LVDS bridge IC application board

2. General description

2.1 Block diagram

Fig 1. DP-LVDS block diagram

UM10492 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.

PTN3460 eDP to LVDS bridge IC application board

2.2 PCB stack ups

Fig 2. DP-LVDS PCB stack up example

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UM10492 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.

PTN3460 eDP to LVDS bridge IC application board

Fig 4.

PTN3460 application board bottom assembly

BOTTOM ASSEMBLY

UM10492 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.

PTN3460 eDP to LVDS bridge IC application board

The PTN3460 AUO application board has the following features:

- Jumpers select multiplex between DP and eDP (iMac) sources - Stuff options for PTN3460 different pin configurations - Stuff options for PS8615 test - Four (4) groups of jumpers for pin configuration - Other jumpers for test options - One serial EEPROM to store EDID read/write via I 2 C-bus - One I^2 C-bus header bringing out I 2 C-bus pins (SCL, SDA, GND) to interface with an

I^2 C Bird (I 2 C tool device name) dongle to program S-EEPROM or to read iMac

System Bus

- One I^2 C-bus header for DDC control - One JTAG for firmware download - One ATX 20-pin power supply with 12 V/5 V/3.3 V DC inputs - External power supplies: +12 V (2 A), +5 V (1 A), +3.3 V (1 A) - Fixed regulator provides 1.8 V  10 % power supply - Two soft-touch connectors (not loaded) for Agilent differential probes to capture LVDS

signals

- One 30-position, 1 mm connector with cables to connect to AUO 21-inch LVDS panel - One 1  8 connector with cable to connect to backlight inverter 3. Hardware requirements - iMac 27-inch AIO, eDP source with 30-position eDP cable - VTG5225-DP, DP source with DP 1.1 cable - DPA-400, AUX analyzer, via iMac eDP-DP adaptor with two DP 1.1 cables and

two 30-position eDP cables

- UFG-04, LVDS grabber, via AUO-grabber adaptor with two MDR-26 twisted cables - Desktop PC with PCIe slot to install LVDS grabber - AUO 21-inch LVDS panel with 30-position LVDS cable - FS2 with 2  5 JTAG connection for firmware download - I^2 C Bird with 1  4 header connection for s-EEPROM read/write 4. Board specifications - Layers: four layers expected — trace, ground, VCC , trace - Size: 4 inches  6 inches - Material: FR - Thickness: 62 mil - Impedance: 50  single-ended, 100  differential on DP and LVDS signal pairs

UM10492 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.

PTN3460 eDP to LVDS bridge IC application board

JP6 CFG4/TDO 1-2 HIGH — LVDS output swing = 400 mV open — LVDS output swing = 300 mV 2-3 LOW — LVDS output swing = 250 mV

JP7 CFG3/TDI 1-2 HIGH — LVDS clock frequency = 0.5 % open — LVDS clock frequency = 1 % 2-3 LOW — LVDS clock frequency = 0 %

JP8 PD_N 1-2 HIGH — Operation mode 2-3 LOW — Force power-down

JP9 CFG2/TMS 1-2 HIGH — JEIDA or VESA format (18 bpp) open — JEIDA format (24 bpp) 2-3 LOW — VESA format (24 bpp)

JP10 CFG1/TCK 1-2 HIGH — Dual LVDS bus 2-3 LOW — Single LVDS bus

JP11 EPS_N ON — Use external 3.3 V/1.8 V option OFF — Use internal 1.8 V LDO

JP12 WP 1-2 HIGH — WP for S-EEPROM 2-3 LOW — No WP S-EEPROM

JP13 VDD_VOL 1-2 — select +3V3 for panel 2-3 — select +5V for panel

JP14 +INV_PWR 1-2 — select +5V for backlight inverter 2-3 — select +12V for backlight inverter

JP15 BKLTEN_CN 1-2 HIGH — Backlight enable is always ON 2-3 BKLTEN — Control by firmware

JP16 PVCCEN_PTN 1-2 HIGH — PVCCEN is always ON 2-3 PVCCEN — Control by firmware

JP

(for PS only)

PVCCEN

(pin 33 is used as I2C_Addr/GPIO in PS8615)

1-2 HIGH — I2C_ADDR 0xB0h to 0xBFh 2-3 LOW — I2C_ADDR 0x10h to 0x1Fh

not loaded

JP18 +12V 1-2 — select from ATX power supply 2-3 — select from external power supply

JP19 +1V8 1-2 — select from U4 regulator 2-3 — select from external power supply

JP20 +5V 1-2 — select from ATX power supply 2-3 — select from external power supply

JP21 +3V3 1-2 — select from ATX power supply 2-3 — select from external power supply

JP22 AIOC_HPD ON — HPD drives Green LED OFF — No LED drive to measure power

Table 3. Jumpers …continued Jumper number

Signal names Jumper settings Default setting

UM10492 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.

PTN3460 eDP to LVDS bridge IC application board

6. Stuffing options

6.1 PTN3460 NXP pinning

6.2 Stuffing locations

Fig 5. PTN3460 pinning

1μF

4.7μF 0.1μF

0.1μF

FB 0.1μF0.01μF

FB

4.7μF

0.1μF

0.1μF 0.1μF

VDD

VDD

VDD

VDD

1 2 3 4 5 6 7 8 9

10 11 12 13 14 1516171819202122232425262728

42 41 40 39 38 37 36 35 34 33 32 31 30 29

5655545352515049484746454443

PTN

0.1μF

Table 4. Stuffing locations Location Function/value PTN3460 (default pinning) R16 Join +3V3_IO with +3V3_LDO no load R17 Pin 27 = CFG4/TDO load R18 Pin 26 = BKLTEN_PTN load R19 Pin 28 - PWMO_PTN load R20 Pin 32 = LVSDE_N_PTN load R21 Pin 31 = LVSDE_P_PTN load R22 Pin 32 = PWMO no load R23 Pin 31 = BKLTEN no load R24 +3V3_LDO for pin 13, 14 load R25 Pin 28 = GND no load R26 Pin 26 = GND no load R27 Pin 27 = GND no load C27 1 F for RST_N line no load C22 0.47 F no load

UM10492 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.

PTN3460 eDP to LVDS bridge IC application board

9. Legal information

9.1 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

9.2 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

9.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

PTN3460 eDP to LVDS bridge IC application board

© NXP Semiconductors N.V. 2015. All rights reserved. Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

 - Date of release: 16 March For more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: [email protected] - Document identifier: UM 
  • 1 Introduction 10. Contents
  • 1.1 Purpose
  • 2 General description
  • 2.1 Block diagram
  • 2.2 PCB stack ups
    • assemblies 2.3 PTN3460 application board top and bottom
  • 3 Hardware requirements.
  • 4 Board specifications
  • 5 Connector specifications
  • 5.1 Connectors
  • 5.2 Cables
  • 5.3 Jumpers
  • 6 Stuffing options
  • 6.1 PTN3460 NXP pinning
  • 6.2 Stuffing locations.
  • 7 Abbreviations
  • 8 References
  • 9 Legal information.
  • 9.1 Definitions
  • 9.2 Disclaimers
  • 9.3 Trademarks.
  • 10 Contents