Voltage: 2.4 to 39 Volts
Power: 200 mWatts
RoHS Device
Page 1
REV:A
Features
-Planar die construction.
-200mW power dissipation.
-Ideally suited for automated assembly
process.
-Ultra small surface mount package.
Mechanical data
-Case: SOT-323, Molded plastic
-Terminals: Solderable per MIL-STD-
202G,method 208
-Polarity: See diagram below
-Mounting position: Any
Marking: see table on page2
CZRV3-55C2V4-G Thru CZRV3-55C39-G
Parameter Symbol Value Unit
Maximum Ratings (TA=25°C, unless otherwise specified)
0.9 V
VF
Forward voltage drop at IF=10mA (Note 2)
Dimensions in inches and (millimeter)
Power dissipation (Note 1) 200
PDmW
QW-BZ015
SOT-323
625 oC/W
RθJA
Thermal resistance, junction to ambient air
Operating junction and storage temperature range -65 to +150
TJ, TSTG OC
SMD Zener Diodes
Comchip Technology CO., LTD.
0.087(2.20)
0.070(1.80)
0.054(1.35)
0.045(1.15)
0.056(1.40)
0.047(1.20)
1 2
3
0.006(0.15)
0.002(0.05)
0.087(2.20)
0.078(2.00)
0.004(0.10)min.
0.004(0.10)max.
0.044(1.10)
0.035(0.90)
0.016(0.40)
0.008(0.20)
Single
Note:
1. Valid provided that device terminals are kept at ambient temperature .
2. Tested with pulses, 300μS pulse width, 2% duty cycle.
