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Características e especificações do MOSFET N-Channel Vishay SUD50N024-09P, Esquemas de Eletrônica

As características e especificações técnicas do mosfet n-channel sud50n024-09p da vishay siliconix. O dispositivo é um power mosfet com temperatura de junção máxima de 175°c e otimizado para alta eficiência pwm. As aplicações incluem conversões dc/dc de alta tensão em dispositivos de escritório e servidor. O documento fornece informações sobre o limite de tensão de junção a tensão de drain-source, corrente de drain continuo e pulsada, resistência de onda de drain-source, capacitâncias de entrada e saída, tempo de transição e outras especificações.

Tipologia: Esquemas

2021

Compartilhado em 07/01/2021

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FEATURES
DTrenchFETr Power MOSFET
D175_C Junction Temperature
DPWM Optimized for High Efficiency
APPLICATIONS
DHigh-Side Synchronous Buck DC/DC
Conversion
Desktop
Server
SUD50N024-09P
Vishay Siliconix
Document Number: 72290
S-41168—Rev. B, 14-Jun-04
www.vishay.com
1
N-Channel 22-V (D-S) 175_C MOSFET
PRODUCT SUMMARY
VDS (V) rDS(on) (W) ID (A)d
24c
0.0095 @ VGS = 10 V 49
24c
0.017 @ VGS = 4.5 V 36
D
G
S
N-Channel MOSFET
TO-252
SGD
Top View
Drain Connected to Tab
Ordering Information: SUD50N024-09P
SUD50N024-09P—E3 (Lead Free)
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter Symbol Limit Unit
Drain-Source Pulse Voltage VDS(pulse) 24C
Drain-Source Voltage VDS 22 V
Gate-Source Voltage VGS "20
Continuous Drain Currenta
TC = 25_C
ID
49d
Continuous Drain Currenta
TC= 100_CID34d
Pulsed Drain Current IDM 100 A
Continuous Source Current (Diode Conduction)aIS4.3
Avalanche Current, Single Pulse L = 0.1 mH IAS 29
Avalanche Energy, Single Pulse EAS 42 mJ
Maximum Power Dissipation
TA = 25_C
PD
6.5a
W
Maximum Power Dissipation TC = 25_CPD39.5 W
Operating Junction and Storage Temperature Range TJ, Tstg 55 to 175 _C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction to Ambienta
t v 10 sec
R
19 23
Maximum Junction-to-Ambienta
Steady State RthJA 40 50 _C/W
Maximum Junction-to-Case RthJC 3.1 3.8
C/W
Notes
a. Surface Mounted on FR4 Board, t v 10 sec.
b. Limited by package
c. Pulse condition: TA = 105_C, 50 ns, 300 kHz operation
d. Calculation based on maximum allowable Junction Temperature. Package limitation current is 25 A.
pf3
pf4
pf5

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FEATURES

 TrenchFET Power MOSFET

 175 C Junction Temperature

 PWM Optimized for High Efficiency

APPLICATIONS

 High-Side Synchronous Buck DC/DC

Conversion

− Desktop

− Server

Vishay Siliconix

Document Number: 72290 S-41168—Rev. B, 14-Jun-

www.vishay.com

N-Channel 22-V (D-S) 175  C MOSFET

PRODUCT SUMMARY

VDS (V) rDS(on) (  ) ID (A)d

24 c

0.0095 @ VGS = 10 V 49

24 c 0.017 @ VGS = 4.5 V 36

D

G

S

N-Channel MOSFET

TO-

G D S

Top View

Drain Connected to Tab

Ordering Information: SUD50N024-09P SUD50N024-09P—E3 (Lead Free)

ABSOLUTE MAXIMUM RATINGS (TA = 25C UNLESS OTHERWISE NOTED)

Parameter Symbol Limit Unit

Drain-Source Pulse Voltage VDS(pulse) 24 C

Drain-Source Voltage VDS 22 V

Gate-Source Voltage VGS  20

Continuous Drain Currenta

T C = 25C

ID

49d Continuous Drain Currenta T (^) C= 100C

ID

34 d

Pulsed Drain Current IDM 100 A

Continuous Source Current (Diode Conduction) a^ IS 4.

Avalanche Current, Single Pulse L = 0.1 mH IAS 29

Avalanche Energy, Single Pulse EAS 42 mJ

Maximum Power Dissipation

TA = 25C

PD

6.5a Maximum Power Dissipation W T (^) C = 25C

PD

W

Operating Junction and Storage Temperature Range T (^) J , Tstg −55 to 175 C

THERMAL RESISTANCE RATINGS

Parameter Symbol Typical Maximum Unit

Maximum Junction to Ambienta

t  10 sec R

Maximum Junction-to-Ambienta Steady State

RthJA (^40 50) C/W

Maximum Junction-to-Case RthJC 3.1 3.

C/W

Notes a. Surface Mounted on FR4 Board, t  10 sec. b. Limited by package c. Pulse condition: TA = 105C, 50 ns, 300 kHz operation d. Calculation based on maximum allowable Junction Temperature. Package limitation current is 25 A.

Vishay Siliconix

www.vishay.com Document Number: 72290 S-41168—Rev. B, 14-Jun-

SPECIFICATIONS (TJ = 25C UNLESS OTHERWISE NOTED)

Parameter Symbol Test Condition Min Typ a^ Max Unit

Static

Drain-Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 250^ A^22 V Gate Threshold Voltage VGS(th) VDS = VGS , ID = 250 A 0.8 3.

V

Gate-Body Leakage IGSS VDS = 0 V, VGS = 20 V  100 nA

Zero Gate Voltage Drain Current IDSS

VDS = 20 V, VGS = 0 V 1

Zero Gate Voltage Drain Current IDSS A VDS = 20 V, VGS = 0 V, TJ = 125C 50

A

On-State Drain Currentb^ ID(on) VDS = 5 V, VGS = 10 V 50 A VGS = 10 V, ID = 20 A 0.008 0.

Drain-Source On-State ResistanceDrain Source On State Resistanceb rr (^) DS(on) (^) DS(on) VGS = 10 V, ID = 20 A, TJ = 125C^ 0.014^  VGS = 4.5 V, ID = 20 A 0.0135 0.

Forward Transconductanceb^ gfs VDS = 15 V, ID = 20 A 15 S

Dynamica

Input Capacitance Ciss 1300 Output Capacitance Coss VGS = 0 V, VDS = 10 V, f = 1 MHz^470 pF Reverse Transfer Capacitance Crss 275

p

Gate Resistance Rg 1.6 4.0 6  Total Gate Chargec^ Q (^) g 10.5 16 Gate-Source Chargec^ Q (^) gs VDS = 10 V, VGS = 4.5 V, ID = 50 A 4.2 (^) nC Gate-Drain Chargec^ Q (^) gd

VDS 10 V, VGS 4.5 V, ID 50 A

nC

Turn-On Delay Timec^ td(on) 8 12 Rise Timec^ tr (^) V DD = 10 V, RL = 0.2^ ^

ns Turn-Off Delay Timec^ td(off)

VDD = 10 V, RL = 0.2 

ID  50 A, VGEN = 10 V, Rg = 2.5  (^25 ) ns

Fall Timec^ tf

g 12 20

Source-Drain Diode Ratings and Characteristic (TC = 25  C)

Pulsed Current ISM 100 A Diode Forward Voltageb^ VSD IF = 50 A, VGS = 0 V 1.2 1.5 V Source-Drain Reverse Recovery Time trr IF = 50 A, di/dt = 100 A/s 35 70 ns

Notes a. Guaranteed by design, not subject to production testing. b. Pulse test; pulse width  300 s, duty cycle  2%. c. Independent of operating temperature.

TYPICAL CHARACTERISTICS (25C UNLESS NOTED)

Output Characteristics Transfer Characteristics

VDS − Drain-to-Source Voltage (V)

Drain Current (A)

I D

VGS − Gate-to-Source Voltage (V)

Drain Current (A)

I D

25 C

125 C

T C = − 55 C

VGS = 10 thru 6 V

3 V

4 V

5 V

Vishay Siliconix

www.vishay.com Document Number: 72290 S-41168—Rev. B, 14-Jun-

THERMAL RATINGS

Safe Operating Area

VDS − Drain-to-Source Voltage (V)

Drain Current (A)

I D

TA = 25C

Single Pulse

Normalized Thermal Transient Impedance, Junction-to-Ambient

Square Wave Pulse Duration (sec)

10 −^4 10 −^3 10 −^2 10 −^1 1

Normalized Effective Transient

Thermal Impedance

Maximum Drain Current vs.

Ambiemt Temperature

TA − Ambient Temperature (C)

Drain Current (A)

I D

Single Pulse

Duty Cycle = 0.

1 ms 10 ms

100 ms

dc

10, 100 s

1 s

10 s 100 s

Limited by r (^) DS(on)

Document Number: 91000 www.vishay.com

Revision: 18-Jul-08 1

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